是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | QFN-20 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 1.67 |
具有ADC: | YES | 地址总线宽度: | |
位大小: | 8 | 最大时钟频率: | 50 MHz |
DAC 通道: | NO | DMA 通道: | NO |
外部数据总线宽度: | JESD-30 代码: | S-XQCC-N20 | |
长度: | 3 mm | I/O 线路数量: | 16 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | UNSPECIFIED | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | ROM可编程性: | FLASH |
座面最大高度: | 0.6 mm | 速度: | 50 MHz |
最大供电电压: | 3.6 V | 最小供电电压: | 2.2 V |
标称供电电压: | 3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | uPs/uCs/外围集成电路类型: | MICROCONTROLLER |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EFM8BB21F16G-C-QSOP24 | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16G-C-QSOP24R | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16G-QFN20 | SILICON |
获取价格 |
EFM8BB21F16G-QFN20 微控制器 (MCU) 建立在低功耗平台基础上,以 5 | |
EFM8BB21F16G-QSOP24 | SILICON |
获取价格 |
EFM8BB21F16G-QSOP24 微控制器 (MCU) 建立在低功耗平台基础上,以 | |
EFM8BB21F16I-C-QFN20 | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16I-C-QFN20R | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16I-C-QSOP24 | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16I-C-QSOP24R | SILICON |
获取价格 |
The addition of automotive devices in the product selection table and ordering information | |
EFM8BB21F16I-QFN20 | SILICON |
获取价格 |
EFM8BB21F16I-QFN20 微控制器 (MCU) 建立在低功耗平台基础上,以 5 | |
EFM8BB21F16I-QSOP24 | SILICON |
获取价格 |
EFM8BB21F16I-QSOP24 微控制器 (MCU) 建立在低功耗平台基础上,以 |