EFA1200A
Excelics
PRELIMINARY DATA SHEET
Low Distortion GaAs Power FET
•
•
•
+37.0dBm TYPICAL OUTPUT POWER
16.0dB TYPICAL POWER GAIN AT 2GHz
0.5 X 12,000 MICRON RECESSED
“MUSHROOM” GATE
•
•
Si3N4 PASSIVATION AND PLATED HEAT SINK
ADVANCED EPITAXIAL DOPING PROFILE
PROVIDES HIGH POWER EFFICIENCY,
LINEARITY AND RELIABILITY
•
Idss SORTED IN 200mA PER BIN RANGE
±
Chip Thickness: 50 10 microns
(with > 20 microns Gold Plated Heat Sink (PHS) )
All Dimensions In Microns
ELECTRICAL CHARACTERISTICS (Ta = 25 OC)
SYMBOLS
PARAMETERS/TEST CONDITIONS
MIN TYP MAX UNIT
Output Power at 1dB Compression
Vds=8V, Ids=50% Idss
Gain at 1dB Compression
Vds=8V, Ids=50% Idss
f= 2GHz
35.5
37.0
37.0
16.0
11.0
dBm
dB
P1dB
f= 4GHz
f= 2GHz
f= 4GHz
14.5
G1dB
Saturated Drain Current Vds=3V, Vgs=0V
2000 3400
1400 1800
-2.0
4400
-3.5
mA
mS
V
Idss
Gm
Transconductance
Pinch-off Voltage
Vds=3V, Vgs=0V
Vds=3V, Ids=30mA
Vp
Drain Breakdown Voltage Igd=12mA
Source Breakdown Voltage Igs=12mA
Thermal Resistance (Au-Sn Eutectic Attach)
-12
-7
-15
-14
4
V
BVgd
BVgs
Rth
V
oC/W
MAXIMUM RATINGS AT 25OC
SYMBOLS
PARAMETERS
Drain-Source Voltage
Gate-Source Voltage
Drain Current
ABSOLUTE1
12V
CONTINUOUS2
8V
Vds
Vgs
Ids
-8V
-4V
Idss
2.0A
Forward Gate Current
Input Power
300mA
36dBm
175oC
50mA
Igsf
Pin
Tch
Tstg
Pt
@3dB Compression
150oC
-65/150oC
Channel Temperature
Storage Temperature
Total Power Dissipation
-65/175oC
34 W
28 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com