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EDK1216CFBJ PDF预览

EDK1216CFBJ

更新时间: 2024-09-15 06:55:55
品牌 Logo 应用领域
尔必达 - ELPIDA 双倍数据速率
页数 文件大小 规格书
56页 708K
描述
128M bits DDR Mobile RAM™

EDK1216CFBJ 数据手册

 浏览型号EDK1216CFBJ的Datasheet PDF文件第2页浏览型号EDK1216CFBJ的Datasheet PDF文件第3页浏览型号EDK1216CFBJ的Datasheet PDF文件第4页浏览型号EDK1216CFBJ的Datasheet PDF文件第5页浏览型号EDK1216CFBJ的Datasheet PDF文件第6页浏览型号EDK1216CFBJ的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
128M bits DDR Mobile RAM  
EDK1216CFBJ (8M words × 16 bits)  
Specifications  
Pin Configurations  
Density: 128M bits  
Organization  
/xxx indicates active low signal.  
60-ball FBGA  
2M words × 16 bits × 4 banks  
1
2
3
4
5
6
7
8
9
10  
Package: 60-ball FBGA  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: VDD, VDDQ = 1.7V to 1.95V  
Clock frequency: 133MHz (max.)  
1KB page size  
A
B
C
D
E
VSS DQ15 VSSQ  
VDDQ DQ13 DQ14  
VSSQ DQ11 DQ12  
VDDQ DQ9 DQ10  
VSSQ UDQS DQ8  
VDDQ DQ0  
VDD  
DQ1  
DQ3  
DQ5  
DQ2 VSSQ  
DQ4 VDDQ  
DQ6 VSSQ  
Row address: A0 to A11  
Column address: A0 to A8  
Four internal banks for concurrent operation  
Interface: LVCMOS  
DQ7 LDQS VDDQ  
Burst lengths (BL): 2, 4, 8, 16  
Burst type (BT):  
Sequential (2, 4, 8, 16)  
Interleave (2, 4, 8, 16)  
/CAS Latency (CL): 3  
F
G
H
UDM  
CK  
VSS  
CKE  
A9  
NC  
/CK  
NC  
A8  
VDD  
NC  
/WE  
/CS  
LDM  
/CAS /RAS  
BA1  
A1  
A11  
A7  
BA0  
A0  
J
Precharge: auto precharge option for each burst  
A6  
A10  
A2  
access  
K
VSS  
A4  
A5  
A3  
VDD  
Driver strength: normal, 1/2, 1/4, 1/8  
Refresh: auto-refresh, self-refresh  
Refresh cycles: 4096 cycles/64ms  
Average refresh period: 15.6µs  
Operating ambient temperature range  
TA =25°C to +85°C  
(Top View)  
Address input  
A0 to A11  
BA0, BA1  
DQ0 to DQ15  
UDQS, LDQS  
/CS  
Bank select address  
Data-input/output  
Input and output data strobe  
Chip select  
/RAS  
/CAS  
/WE  
UDM, LDM  
CK  
/CK  
CKE  
VDD  
Row address strobe  
Column address strobe  
Write enable  
Write data mask  
Clock input  
Features  
Low power consumption  
Partial Array Self-Refresh (PASR)  
Differential clock input  
Clock enable  
Auto Temperature Compensated Self-Refresh  
(ATCSR) by built-in temperature sensor  
Power for internal circuit  
Ground for internal circuit  
Power for DQ circuit  
Ground for DQ circuit  
No connection  
VSS  
Double-data-rate architecture; two data transfers per  
VDDQ  
VSSQ  
NC  
one clock cycle  
Bi-directional data strobe (DQS) is transmitted  
/received with data for capturing data at the receiver.  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Burst termination by burst stop command and  
Precharge command  
Document No. E1194E20 (Ver. 2.0)  
Date Published October 2009 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2007-2009  

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