PRELIMINARY DATA SHEET
128M bits DDR Mobile RAM
EDK1216CFBJ (8M words × 16 bits)
Specifications
Pin Configurations
• Density: 128M bits
• Organization
/xxx indicates active low signal.
60-ball FBGA
2M words × 16 bits × 4 banks
1
2
3
4
5
6
7
8
9
10
• Package: 60-ball FBGA
Lead-free (RoHS compliant) and Halogen-free
• Power supply: VDD, VDDQ = 1.7V to 1.95V
• Clock frequency: 133MHz (max.)
• 1KB page size
A
B
C
D
E
VSS DQ15 VSSQ
VDDQ DQ13 DQ14
VSSQ DQ11 DQ12
VDDQ DQ9 DQ10
VSSQ UDQS DQ8
VDDQ DQ0
VDD
DQ1
DQ3
DQ5
DQ2 VSSQ
DQ4 VDDQ
DQ6 VSSQ
Row address: A0 to A11
Column address: A0 to A8
• Four internal banks for concurrent operation
• Interface: LVCMOS
DQ7 LDQS VDDQ
• Burst lengths (BL): 2, 4, 8, 16
• Burst type (BT):
Sequential (2, 4, 8, 16)
Interleave (2, 4, 8, 16)
• /CAS Latency (CL): 3
F
G
H
UDM
CK
VSS
CKE
A9
NC
/CK
NC
A8
VDD
NC
/WE
/CS
LDM
/CAS /RAS
BA1
A1
A11
A7
BA0
A0
J
• Precharge: auto precharge option for each burst
A6
A10
A2
access
K
VSS
A4
A5
A3
VDD
• Driver strength: normal, 1/2, 1/4, 1/8
• Refresh: auto-refresh, self-refresh
• Refresh cycles: 4096 cycles/64ms
Average refresh period: 15.6µs
• Operating ambient temperature range
TA =−25°C to +85°C
(Top View)
Address input
A0 to A11
BA0, BA1
DQ0 to DQ15
UDQS, LDQS
/CS
Bank select address
Data-input/output
Input and output data strobe
Chip select
/RAS
/CAS
/WE
UDM, LDM
CK
/CK
CKE
VDD
Row address strobe
Column address strobe
Write enable
Write data mask
Clock input
Features
• Low power consumption
• Partial Array Self-Refresh (PASR)
Differential clock input
Clock enable
• Auto Temperature Compensated Self-Refresh
(ATCSR) by built-in temperature sensor
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
VSS
• Double-data-rate architecture; two data transfers per
VDDQ
VSSQ
NC
one clock cycle
• Bi-directional data strobe (DQS) is transmitted
/received with data for capturing data at the receiver.
• DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• Commands entered on each positive CK edge: data
and data mask referenced to both edges of DQS
• Burst termination by burst stop command and
Precharge command
Document No. E1194E20 (Ver. 2.0)
Date Published October 2009 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2007-2009