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EDJ4208EASE-DJ-F PDF预览

EDJ4208EASE-DJ-F

更新时间: 2024-11-28 21:15:35
品牌 Logo 应用领域
尔必达 - ELPIDA 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
146页 1782K
描述
DDR DRAM, 512MX8, 0.255ns, CMOS, PBGA78, HALOGEN FREE AND ROHS COMPLIANT, FBGA-78

EDJ4208EASE-DJ-F 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA78,9X13,32
针数:78Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.73访问模式:MULTI BANK PAGE BURST
最长访问时间:0.255 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):667 MHzI/O 类型:COMMON
交错的突发长度:4,8JESD-30 代码:R-PBGA-B78
JESD-609代码:e1长度:13 mm
内存密度:4294967296 bit内存集成电路类型:DDR DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:78
字数:536870912 words字数代码:512000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:512MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA78,9X13,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.35 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:4,8最大待机电流:0.02 A
子类别:DRAMs最大压摆率:0.325 mA
最大供电电压 (Vsup):1.45 V最小供电电压 (Vsup):1.283 V
标称供电电压 (Vsup):1.35 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:9.3 mmBase Number Matches:1

EDJ4208EASE-DJ-F 数据手册

 浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第2页浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第3页浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第4页浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第5页浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第6页浏览型号EDJ4208EASE-DJ-F的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
4G bits DDR3L SDRAM  
EDJ4204EASE (1024M words × 4 bits)  
EDJ4208EASE (512M words × 8 bits)  
Features  
Specifications  
Density: 4G bits  
Organization  
128M words × 4 bits × 8 banks (EDJ4204EASE)  
64M words × 8 bits × 8 banks (EDJ4208EASE)  
Package  
Double-data-rate architecture: two data transfers per  
clock cycle  
The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
78-ball FBGA  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: 1.35V (typ.)  
VDD, VDDQ = 1.283V to 1.45V  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
Backward compatible for VDD, VDDQ  
transitions  
= 1.5V ± 0.075V  
Commands entered on each positive CK edge; data  
Data rate  
1333Mbps/1066Mbps (max.)  
1KB page size  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
Posted /CAS by programmable additive latency for  
Row address: A0 to A15  
better command and data bus efficiency  
Column address: A0 to A9, A11 (EDJ4204EASE)  
On-Die Termination (ODT) for better signal quality  
Synchronous ODT  
A0 to A9 (EDJ4208EASE)  
Eight internal banks for concurrent operation  
Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
Burst type (BT):  
Sequential (8, 4 with BC)  
Interleave (8, 4 with BC)  
/CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11  
/CAS Write Latency (CWL): 5, 6, 7, 8  
Dynamic ODT  
Asynchronous ODT  
Multi Purpose Register (MPR) for pre-defined pattern  
read out  
ZQ calibration for DQ drive and ODT  
Programmable Partial Array Self-Refresh (PASR)  
/RESET pin for Power-up sequence and reset  
Precharge: auto precharge option for each burst  
function  
access  
SRT range:  
Normal/extended  
Programmable Output driver impedance control  
Driver strength: RZQ/7, RZQ/6 (RZQ = 240)  
Refresh: auto-refresh, self-refresh  
Refresh cycles  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
Operating case temperature range  
TC = 0°C to +95°C  
Document No. E1727E30 (Ver. 3.0)  
Date Published January 2011 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2010-2011  

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