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EDJ1116DBSE-8A-F PDF预览

EDJ1116DBSE-8A-F

更新时间: 2024-11-28 19:53:47
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器
页数 文件大小 规格书
179页 2013K
描述
DRAM,

EDJ1116DBSE-8A-F 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknown风险等级:5.75
Base Number Matches:1

EDJ1116DBSE-8A-F 数据手册

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PRELIMINARY DATA SHEET  
1G bits DDR3 SDRAM  
EDJ1108DBSE (128M words × 8 bits)  
EDJ1116DBSE (64M words × 16 bits)  
Features  
Specifications  
Density: 1G bits  
Organization  
Double-data-rate architecture; two data transfers per  
clock cycle  
The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
16M words × 8 bits × 8 banks (EDJ1108DBSE)  
8M words × 16 bits × 8 banks (EDJ1116DBSE)  
Package  
78-ball FBGA (EDJ1108DBSE)  
96-ball FBGA (EDJ1116DBSE)  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: VDD, VDDQ = 1.5V 0.075V  
Data rate  
1600Mbps/1333Mbps/1066Mbps/800Mbps (max.)  
1KB page size (EDJ1108DBSE)  
Row address: A0 to A13  
Column address: A0 to A9 (EDJ1108DBSE)  
2KB page size (EDJ1116DBSE)  
Row address: A0 to A12  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
On-Die Termination (ODT) for better signal quality  
Synchronous ODT  
Dynamic ODT  
Asynchronous ODT  
Multi Purpose Register (MPR) for temperature read  
out  
Column address: A0 to A9  
Eight internal banks for concurrent operation  
Interface: SSTL_15  
Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
Burst type (BT):  
Sequential (8, 4 with BC)  
Interleave (8, 4 with BC)  
ZQ calibration for DQ drive and ODT  
Programmable Partial Array Self-Refresh (PASR)  
/CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11  
/CAS Write Latency (CWL): 5, 6, 7, 8  
/RESET pin for Power-up sequence and reset  
function  
SRT range:  
Normal/extended  
Precharge: auto precharge option for each burst  
access  
Driver strength: RZQ/7, RZQ/6, RZQ/5 (RZQ = 240)  
Refresh: auto-refresh, self-refresh  
Refresh cycles  
Programmable Output driver impedance control  
Seamless BL4 access with bank-grouping  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
Operating case temperature range  
TC = 0°C to +95°C  
Document No. E1463E30 (Ver. 3.0)  
Date Published July 2009 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
©Elpida Memory, Inc. 2009  

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