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EDJ1108EJBG-GN-F PDF预览

EDJ1108EJBG-GN-F

更新时间: 2024-11-28 12:51:35
品牌 Logo 应用领域
尔必达 - ELPIDA 时钟
页数 文件大小 规格书
32页 525K
描述
Differential clock inputs

EDJ1108EJBG-GN-F 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:78
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.32风险等级:5.83
访问模式:MULTI BANK PAGE BURST其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PBGA-B78JESD-609代码:e1
长度:11 mm内存密度:1073741824 bit
内存集成电路类型:DRAM MODULE内存宽度:8
功能数量:1端口数量:1
端子数量:78字数:134217728 words
字数代码:128000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:128MX8封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):1.45 V
最小供电电压 (Vsup):1.283 V标称供电电压 (Vsup):1.35 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:7.5 mm
Base Number Matches:1

EDJ1108EJBG-GN-F 数据手册

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COVER  
PRELIMINARY DATA SHEET  
1G bits DDR3L SDRAM  
EDJ1108EJBG (128M words × 8 bits)  
EDJ1116EJBG (64M words × 16 bits)  
Specifications  
Features  
• Density: 1G bits  
• Organization  
• Double-data-rate architecture: two data transfers per  
clock cycle  
• The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
• Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
• DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
• Differential clock inputs (CK and /CK)  
— 16M words × 8 bits × 8 banks (EDJ1108EJBG)  
— 8M words × 16 bits × 8 banks (EDJ1116EJBG)  
• Package  
— 78-ball FBGA (EDJ1108EJBG)  
— 96-ball FBGA (EDJ1116EJBG)  
— Lead-free (RoHS compliant) and Halogen-free  
• Power supply: 1.35V (typ)  
— VDD = 1.283V to 1.45V  
• DLL aligns DQ and DQS transitions with CK transitions  
— Backward compatible for VDD, VDDQ  
= 1.5V 0.075V  
• Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
• Data rate  
• Data mask (DM) for write data  
— 1866Mbps/1600Mbps/1333Mbps (max)  
• 1KB page size (EDJ1108EJBG)  
— Row address: A0 to A13  
— Column address: A0 to A9  
• 2KB page size (EDJ1116EJBG)  
— Row address: A0 to A12  
• Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
• On-Die Termination (ODT) for better signal quality  
— Synchronous ODT  
— Dynamic ODT  
— Asynchronous ODT  
— Column address: A0 to A9  
• Eight internal banks for concurrent operation  
• Burst length (BL): 8 and 4 with Burst Chop (BC)  
• Burst type (BT):  
• Multi Purpose Register (MPR) for pre-defined pattern  
read out  
• ZQ calibration for DQ drive and ODT  
• /RESET pin for Power-up sequence and reset function  
• SRT range:  
— Sequential (8, 4 with BC)  
— Normal/extended  
— Interleave (8, 4 with BC)  
• Programmable Output driver impedance control  
• Seamless BL4 access with bank-grouping  
— Applied only for DDR3-1333 and 1600  
• /CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11, 13  
• /CAS Write Latency (CWL): 5, 6, 7, 8, 9  
• Precharge: auto precharge option for each burst  
access  
• Driver strength: RZQ/7, RZQ/6 (RZQ = 240)  
• Refresh: auto-refresh, self-refresh  
• Refresh cycles  
— Average refresh period  
7.8µs at 0°C TC +85°C  
3.9µs at +85°C < TC +95°C  
• Operating case temperature range  
— TC = 0°C to +95°C  
Document. No. E1949E11 (Ver. 1.1)  
Date Published September 2012 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
©Elpida Memory, Inc. 2012  

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