是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Reach Compliance Code: | unknown |
风险等级: | 5.63 | 最长访问时间: | 20 ns |
其他特性: | TTL COMPATIBLE INPUTS/OUTPUTS | I/O 类型: | COMMON |
JESD-30 代码: | R-CDIP-T32 | 长度: | 40.64 mm |
内存密度: | 4194304 bit | 内存集成电路类型: | STANDARD SRAM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 32 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 512KX8 | 输出特性: | 3-STATE |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | DIP |
封装等效代码: | DIP32,.4 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 并行/串行: | PARALLEL |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 3.937 mm |
最大待机电流: | 0.025 A | 最小待机电流: | 4.5 V |
子类别: | SRAMs | 最大压摆率: | 0.225 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 10.16 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
EDI88512CA25B32B | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDSO32, CERAMIC, DFP-32 | |
EDI88512CA25B32C | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDSO32, CERAMIC, DFP-32 | |
EDI88512CA25B32I | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDSO32, CERAMIC, DFP-32 | |
EDI88512CA25B32M | ETC |
获取价格 |
x8 SRAM | |
EDI88512CA25CB | MERCURY |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
EDI88512CA25CC | MERCURY |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
EDI88512CA25CI | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
EDI88512CA25CI | MERCURY |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | |
EDI88512CA25CM | ETC |
获取价格 |
x8 SRAM | |
EDI88512CA25F32B | MICROSEMI |
获取价格 |
Standard SRAM, 512KX8, 25ns, CMOS, CDFP32, CERAMIC, DFP-32 |