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EDE5132BABG-6G-F PDF预览

EDE5132BABG-6G-F

更新时间: 2024-11-26 11:45:07
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率
页数 文件大小 规格书
74页 721K
描述
512M bits DDR2 SDRAM

EDE5132BABG-6G-F 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:128
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.28风险等级:5.84
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:0.45 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PBGA-B128JESD-609代码:e1
长度:13.5 mm内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:128字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:16MX32封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):1.575 V最小供电电压 (Vsup):1.425 V
标称供电电压 (Vsup):1.5 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:10.5 mmBase Number Matches:1

EDE5132BABG-6G-F 数据手册

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PRELIMINARY DATA SHEET  
512M bits DDR2 SDRAM  
EDE5132BABG (16M words × 32 bits)  
Specifications  
Features  
Density: 512M bits  
Double-data-rate architecture; two data transfers per  
clock cycle  
Organization  
The high-speed data transfer is realized by the 4 bits  
prefetch pipelined architecture  
4M words × 32 bits × 4 banks  
Package  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
128-ball FBGA  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: VDD, VDDQ = 1.5V ± 0.075V  
Data rate: 667Mbps (max.)  
2KB page size  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Row address: A0 to A12  
Column address: A0 to A8  
Four internal banks for concurrent operation  
Interface: SSTL_18  
Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
Burst lengths (BL): 4, 8  
Burst type (BT):  
Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
Sequential (4, 8)  
/DQS can be disabled for single-ended Data Strobe  
operation  
Interleave (4, 8)  
/CAS Latency (CL): 3, 4, 5, 6  
Precharge: auto precharge option for each burst  
access  
Driver strength: normal, weak, 1/4  
Refresh: auto-refresh, self-refresh  
Refresh cycles: 8192 cycles/64ms  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
Operating case temperature range  
TC = 0°C to +95°C  
Document No. E1372E10 (Ver. 1.0)  
Date Published August 2008 (K) Japan  
This product became EOL in March, 2010.  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2008  

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