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EDE2516AASE PDF预览

EDE2516AASE

更新时间: 2024-11-07 06:55:55
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
66页 673K
描述
256M bits DDR2 SDRAM

EDE2516AASE 数据手册

 浏览型号EDE2516AASE的Datasheet PDF文件第2页浏览型号EDE2516AASE的Datasheet PDF文件第3页浏览型号EDE2516AASE的Datasheet PDF文件第4页浏览型号EDE2516AASE的Datasheet PDF文件第5页浏览型号EDE2516AASE的Datasheet PDF文件第6页浏览型号EDE2516AASE的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
256M bits DDR2 SDRAM  
EDE2504AASE (64M words × 4 bits)  
EDE2508AASE (32M words × 8 bits)  
EDE2516AASE (16M words × 16 bits)  
Features  
Description  
The EDE2504AA is a 256M bits DDR2 SDRAM  
1.8V power supply  
organized as 16,777,216 words × 4 bits × 4 banks.  
Double-data-rate architecture: two data transfers per  
clock cycle  
The EDE2508AA is a 256M bits DDR2 SDRAM  
organized as 8,388,608 words × 8 bits × 4 banks.  
Bi-directional, differential data strobe (DQS and  
/DQS) is transmitted/received with data, to be used in  
capturing data at the receiver  
They are packaged in 64-ball FBGA package.  
The EDE2516AA is a 256M bits DDR2 SDRAM  
organized as 4,194,304 words × 16 bits × 4 banks.  
DQS is edge aligned with data for READs: center-  
aligned with data for WRITEs  
It is packaged in 84-ball FBGA package.  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Four internal banks for concurrent operation  
Data mask (DM) for write data  
Burst lengths: 4, 8  
/CAS Latency (CL): 3, 4, 5  
Auto precharge operation for each burst access  
Auto refresh and self refresh modes  
7.8µs average periodic refresh interval  
1.8V (SSTL_18 compatible) I/O  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
Programmable RDQS, /RDQS output for making × 8  
organization compatible to × 4 organization  
/DQS, (/RDQS) can be disabled for single-ended  
Data Strobe operation.  
FBGA package is lead free solder (Sn-Ag-Cu)  
Document No. E0427E11 (Ver. 1.1)  
Date Published February 2006 (K) Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2003-2006  

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