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EDE2508AASE-AE-E PDF预览

EDE2508AASE-AE-E

更新时间: 2024-09-18 06:55:55
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率
页数 文件大小 规格书
66页 673K
描述
256M bits DDR2 SDRAM for HYPER DIMM

EDE2508AASE-AE-E 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA,
针数:64Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.84Is Samacsys:N
访问模式:FOUR BANK PAGE BURST最长访问时间:0.5 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B64
JESD-609代码:e1长度:13.8 mm
内存密度:268435456 bit内存集成电路类型:DDR DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:64
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:32MX8
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.12 mm自我刷新:YES
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.8 V
标称供电电压 (Vsup):1.85 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:11.3 mm
Base Number Matches:1

EDE2508AASE-AE-E 数据手册

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PRELIMINARY DATA SHEET  
256M bits DDR2 SDRAM  
for HYPER DIMM  
EDE2508AASE-DF, -BE, -AE (32M words × 8 bits)  
EDE2516AASE-DF, -BE, -AE (16M words × 16 bits)  
Description  
Features  
The EDE2508AA is a 256M bits DDR2 SDRAM  
1.8V power supply  
organized as 8,388,608 words × 8 bits × 4 banks.  
Double-data-rate architecture: two data transfers per  
clock cycle  
It is packaged in 64-ball FBGA package.  
Bi-directional, differential data strobe (DQS and  
/DQS) is transmitted/received with data, to be used in  
capturing data at the receiver  
The EDE2516AA is a 256M bits DDR2 SDRAM  
organized as 4,194,304 words × 16 bits × 4 banks.  
It is packaged in 84-ball FBGA package.  
DQS is edge aligned with data for READs: center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Four internal banks for concurrent operation  
Data mask (DM) for write data  
Burst lengths: 4, 8  
/CAS Latency (CL): 3, 4, 5  
Auto precharge operation for each burst access  
Auto refresh and self refresh modes  
7.8µs average periodic refresh interval  
1.8V (SSTL_18 compatible) I/O  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
Programmable RDQS, /RDQS output for making × 8  
organization compatible to × 4 organization  
/DQS, (/RDQS) can be disabled for single-ended  
Data Strobe operation.  
FBGA package with lead free solder (Sn-Ag-Cu)  
Document No. E0515E12 (Ver. 1.2)  
Date Published February 2006 (K) Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2004-2006  

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