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EDD5116AFTA-5 PDF预览

EDD5116AFTA-5

更新时间: 2024-11-06 22:32:11
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
48页 540K
描述
512M bits DDR SDRAM

EDD5116AFTA-5 数据手册

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DATA SHEET  
512M bits DDR SDRAM  
EDD5108AFTA-5 (64M words × 8 bits, DDR400)  
EDD5116AFTA-5 (32M words × 16 bits, DDR400)  
Description  
Pin Configurations  
The EDD5108AFTA and the EDD5116AFTA are 512M  
bits Double Data Rate (DDR) SDRAM organized as  
16,777,216 words × 8 bits × 4 banks and 8,388,608  
words × 16 bits × 4 banks, respectively. Read and  
write operations are performed at the cross points of  
the CK and the /CK. This high-speed data transfer is  
realized by the 2 bits prefetch-pipelined architecture.  
Data strobe (DQS) both for read and write are available  
for high speed and reliable data bus design. By setting  
extended mode register, the on-chip Delay Locked  
Loop (DLL) can be set enable or disable. They are  
packaged in standard 66-pin plastic TSOP (II).  
/xxx indicates active low signal.  
66-pin Plastic TSOP(II)  
VDD  
DQ0  
VDD  
DQ0  
1
2
66  
VSS VSS  
DQ15 DQ7  
VSSQ VSSQ  
DQ14 NC  
DQ13 DQ6  
VDDQ VDDQ  
DQ12 NC  
DQ11 DQ5  
VSSQ VSSQ  
DQ10 NC  
DQ9 DQ4  
VDDQ VDDQ  
DQ8 NC  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
VDDQ VDDQ  
3
NC  
DQ1  
DQ1  
DQ2  
4
5
VSSQ VSSQ  
6
NC  
DQ2  
DQ3  
DQ4  
7
8
VDDQ VDDQ  
9
NC  
DQ3  
VSSQ VSSQ  
NC  
NC  
VDDQ VDDQ  
NC LDQS  
NC  
VDD  
NC  
DQ5  
DQ6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
DQ7  
NC  
NC  
NC  
Features  
VSSQ  
VSSQ  
UDQS DQS  
NC  
NC  
VREF VREF  
VSS VSS  
UDM DM  
/CK /CK  
NC  
VDD  
NC  
LDM  
/WE  
/CAS  
/RAS  
/CS  
Power supply: VDD ,VDDQ = 2.6V ± 0.1V  
Data rate: 400Mbps (max.)  
NC  
Double Data Rate architecture; two data transfers per  
/WE  
/CAS  
/RAS  
/CS  
NC  
BA0  
BA1  
clock cycle  
CK  
CKE CKE  
NC  
NC  
CK  
Bi-directional data strobe (DQS) is transmitted  
/received with data for capturing data at the receiver  
NC  
BA0  
BA1  
A12 A12  
A11 A11  
Data inputs, outputs, and DM are synchronized with  
A9  
A8  
A7  
A6  
A5  
A4  
A9  
A8  
A7  
A6  
A5  
A4  
DQS  
A10(AP) A10(AP)  
4 internal banks for concurrent operation  
A0  
A1  
A2  
A3  
VDD  
A0 29  
A1  
A2  
30  
31  
32  
33  
DQS is edge aligned with data for READs; center  
aligned with data for WRITEs  
A3  
VDD  
VSS VSS  
Differential clock inputs (CK and /CK)  
X 16  
X 8  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge; data  
(Top view)  
and data mask referenced to both edges of DQS  
A0 to A12  
BA0, BA1  
DQ0 to DQ15  
Address input  
Bank select address  
Data-input/output  
Data mask (DM) for write data  
Auto precharge option for each burst access  
SSTL_2 compatible I/O  
Programmable burst length (BL): 2, 4, 8  
Programmable /CAS latency (CL): 3  
Programmable output driver strength: normal/weak  
Refresh cycles: 8192 refresh cycles/64ms  
7.8µs maximum average periodic refresh interval  
2 variations of refresh  
Auto refresh  
Self refresh  
TSOP (II) package with lead free solder (Sn-Bi)  
RoHS compliant  
DQS, LDQS, UDQS Input and output data strobe  
/CS  
Chip select  
/RAS  
/CAS  
/WE  
DM, LDM, UDM  
CK  
/CK  
CKE  
VREF  
VDD  
VSS  
Row address strobe command  
Column address strobe command  
Write enable  
Input mask  
Clock input  
Differential clock input  
Clock enable  
Input reference voltage  
Power for internal circuit  
Ground for internal circuit  
Power for DQ circuit  
Ground for DQ circuit  
No connection  
VDDQ  
VSSQ  
NC  
Document No. E0741E20 (Ver. 2.0)  
Date Published October 2005 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2005  

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