DATA SHEET
512M bits DDR SDRAM
EDD5108AFTA-5 (64M words × 8 bits, DDR400)
EDD5116AFTA-5 (32M words × 16 bits, DDR400)
Description
Pin Configurations
The EDD5108AFTA and the EDD5116AFTA are 512M
bits Double Data Rate (DDR) SDRAM organized as
16,777,216 words × 8 bits × 4 banks and 8,388,608
words × 16 bits × 4 banks, respectively. Read and
write operations are performed at the cross points of
the CK and the /CK. This high-speed data transfer is
realized by the 2 bits prefetch-pipelined architecture.
Data strobe (DQS) both for read and write are available
for high speed and reliable data bus design. By setting
extended mode register, the on-chip Delay Locked
Loop (DLL) can be set enable or disable. They are
packaged in standard 66-pin plastic TSOP (II).
/xxx indicates active low signal.
66-pin Plastic TSOP(II)
VDD
DQ0
VDD
DQ0
1
2
66
VSS VSS
DQ15 DQ7
VSSQ VSSQ
DQ14 NC
DQ13 DQ6
VDDQ VDDQ
DQ12 NC
DQ11 DQ5
VSSQ VSSQ
DQ10 NC
DQ9 DQ4
VDDQ VDDQ
DQ8 NC
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
VDDQ VDDQ
3
NC
DQ1
DQ1
DQ2
4
5
VSSQ VSSQ
6
NC
DQ2
DQ3
DQ4
7
8
VDDQ VDDQ
9
NC
DQ3
VSSQ VSSQ
NC
NC
VDDQ VDDQ
NC LDQS
NC
VDD
NC
DQ5
DQ6
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
DQ7
NC
NC
NC
Features
VSSQ
VSSQ
UDQS DQS
NC
NC
VREF VREF
VSS VSS
UDM DM
/CK /CK
NC
VDD
NC
LDM
/WE
/CAS
/RAS
/CS
• Power supply: VDD ,VDDQ = 2.6V ± 0.1V
• Data rate: 400Mbps (max.)
NC
• Double Data Rate architecture; two data transfers per
/WE
/CAS
/RAS
/CS
NC
BA0
BA1
clock cycle
CK
CKE CKE
NC
NC
CK
• Bi-directional data strobe (DQS) is transmitted
/received with data for capturing data at the receiver
NC
BA0
BA1
A12 A12
A11 A11
• Data inputs, outputs, and DM are synchronized with
A9
A8
A7
A6
A5
A4
A9
A8
A7
A6
A5
A4
DQS
A10(AP) A10(AP)
• 4 internal banks for concurrent operation
A0
A1
A2
A3
VDD
A0 29
A1
A2
30
31
32
33
• DQS is edge aligned with data for READs; center
aligned with data for WRITEs
A3
VDD
VSS VSS
• Differential clock inputs (CK and /CK)
X 16
X 8
• DLL aligns DQ and DQS transitions with CK
transitions
• Commands entered on each positive CK edge; data
(Top view)
and data mask referenced to both edges of DQS
A0 to A12
BA0, BA1
DQ0 to DQ15
Address input
Bank select address
Data-input/output
• Data mask (DM) for write data
• Auto precharge option for each burst access
• SSTL_2 compatible I/O
• Programmable burst length (BL): 2, 4, 8
• Programmable /CAS latency (CL): 3
• Programmable output driver strength: normal/weak
• Refresh cycles: 8192 refresh cycles/64ms
7.8µs maximum average periodic refresh interval
• 2 variations of refresh
Auto refresh
Self refresh
• TSOP (II) package with lead free solder (Sn-Bi)
RoHS compliant
DQS, LDQS, UDQS Input and output data strobe
/CS
Chip select
/RAS
/CAS
/WE
DM, LDM, UDM
CK
/CK
CKE
VREF
VDD
VSS
Row address strobe command
Column address strobe command
Write enable
Input mask
Clock input
Differential clock input
Clock enable
Input reference voltage
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
VDDQ
VSSQ
NC
Document No. E0741E20 (Ver. 2.0)
Date Published October 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2005