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EDD5116AFBG-6B-E PDF预览

EDD5116AFBG-6B-E

更新时间: 2024-11-07 11:45:07
品牌 Logo 应用领域
尔必达 - ELPIDA 存储内存集成电路动态存储器双倍数据速率
页数 文件大小 规格书
52页 593K
描述
512M bits DDR SDRAM

EDD5116AFBG-6B-E 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:60
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.28风险等级:5.8
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:0.7 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PBGA-B60JESD-609代码:e1
长度:12.5 mm内存密度:536870912 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:60字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:10 mmBase Number Matches:1

EDD5116AFBG-6B-E 数据手册

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PRELIMINARY DATA SHEET  
512M bits DDR SDRAM  
EDD5108AFBG (64M words × 8 bits)  
EDD5116AFBG (32M words × 16 bits)  
Features  
Specifications  
Density: 512M bits  
Organization  
16M words × 8 bits × 4 banks (EDD5108AFBG)  
8M words × 16 bits × 4 banks (EDD5116AFBG)  
Package: 60-ball FBGA  
Lead-free (RoHS compliant)  
Power supply:  
Double-data-rate architecture; two data transfers per  
clock cycle  
The high-speed data transfer is realized by the 2 bits  
prefetch pipelined architecture  
Bi-directional data strobe (DQS) is transmitted  
/received with data for capturing data at the receiver  
Data inputs, outputs, and DM are synchronized with  
DQS  
DDR400: VDD, VDDQ = 2.6V ± 0.1V  
DDR333: VDD, VDDQ = 2.5V ± 0.2V  
Data rate: 400Mbps/333Mbps (max.)  
Four internal banks for concurrent operation  
Interface: SSTL_2  
Burst lengths (BL): 2, 4, 8  
Burst type (BT):  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
Sequential (2, 4, 8)  
Interleave (2, 4, 8)  
/CAS Latency (CL): 2, 2.5, 3  
Precharge: auto precharge option for each burst  
access  
Driver strength: normal/weak  
Refresh: auto-refresh, self-refresh  
Refresh cycles: 8192 cycles/64ms  
Average refresh period: 7.8µs  
Operating ambient temperature range  
TA = 0°C to +70°C  
Document No. E0887E20 (Ver. 2.0)  
This product became EOL in April, 2010.  
Date Published November 2006 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2006  

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