DATA SHEET
512M bits DDR SDRAM
WTR (Wide Temperature Range)
EDD5108ADTA-LI (64M words × 8 bits)
EDD5116ADTA-LI (32M words × 16 bits)
Pin Configurations
Description
The EDD5108AD and the EDD5116AD are 512M bits
Double Data Rate (DDR) SDRAM. Read and write
operations are performed at the cross points of the CK
and the /CK. This high-speed data transfer is realized
by the 2 bits prefetch-pipelined architecture. Data
strobe (DQS) both for read and write are available for
high speed and reliable data bus design. By setting
extended mode register, the on-chip Delay Locked
Loop (DLL) can be set enable or disable.
/xxx indicates active low signal.
66-pin Plastic TSOP(II)
VDD
DQ0
VDD
DQ0
1
2
66
VSS VSS
DQ15 DQ7
VSSQ VSSQ
DQ14 NC
DQ13 DQ6
VDDQ VDDQ
DQ12 NC
DQ11 DQ5
VSSQ VSSQ
DQ10 NC
DQ9 DQ4
VDDQ VDDQ
DQ8 NC
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
VDDQ VDDQ
3
NC
DQ1
DQ1
DQ2
4
5
VSSQ VSSQ
6
NC
DQ2
DQ3
DQ4
7
8
VDDQ VDDQ
9
NC
DQ3
VSSQ VSSQ
NC
NC
VDDQ VDDQ
NC LDQS
NC
VDD
NC
DQ5
DQ6
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Features
DQ7
NC
• Power supply: VDD, VDDQ = 2.5V ± 0.2V
• Data Rate: 333Mbps/266Mbps (max.)
NC
NC
VSSQ VSSQ
UDQS DQS
• Double Data Rate architecture; two data transfers per
NC
VDD
NC
LDM
/WE
/CAS
/RAS
/CS 24
NC
NC
clock cycle
VREF VREF
VSS VSS
UDM DM
/CK /CK
• Bi-directional, data strobe (DQS) is transmitted
/received with data, to be used in capturing data at
the receiver
NC
/WE
/CAS
/RAS
/CS
CK
CKE CKE
NC
NC
CK
• Data inputs, outputs, and DM are synchronized with
NC
BA0
BA1
NC
BA0
BA1
25
26
27
28
29
30
31
32
33
A12 A12
A11 A11
DQS
• 4 internal banks for concurrent operation
A9
A8
A7
A6
A5
A4
A9
A8
A7
A6
A5
A4
A10(AP) A10(AP)
• DQS is edge aligned with data for READs; center
A0
A1
A2
A3
VDD
A0
A1
A2
A3
VDD
aligned with data for WRITEs
• Differential clock inputs (CK and /CK)
VSS VSS
• DLL aligns DQ and DQS transitions with CK
transitions
X 16
X 8
• Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
(Top view)
• Data mask (DM) for write data
• Auto precharge option for each burst access
• SSTL_2 compatible I/O
A0 to A12
BA0, BA1
DQ0 to DQ15
Address input
Bank select address
Data-input/output
DQS, LDQS, UDQS Input and output data strobe
• Programmable burst length (BL): 2, 4, 8
• Programmable /CAS latency (CL): 2, 2.5
• Programmable output driver strength: normal/weak
• Refresh cycles: 8192 refresh cycles/64ms
7.8µs maximum average periodic refresh interval
• 2 variations of refresh
Auto refresh
Self refresh
• Ambient temperature range: −40 to +85°C
/CS
Chip select
/RAS
/CAS
/WE
DM, LDM, UDM
CK
/CK
CKE
VREF
VDD
VSS
Row address strobe command
Column address strobe command
Write enable
Input mask
Clock input
Differential clock input
Clock enable
Input reference voltage
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
VDDQ
VSSQ
NC
Document No. E0505E10 (Ver. 1.0)
This product became EOL in September, 2007.
Date Published March 2004 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2004