PRELIMINARY DATA SHEET
256M bits DDR SDRAM
with Super Self-Refresh
EDD2516KCTA-SI (16M words × 16 bits)
Specifications
Pin Configurations
• Density: 256M bits
/xxx indicates active low signal.
• Organization
66-pin Plastic TSOP(II)
⎯ 4M words × 16 bits × 4 banks
• Package: 66-pin plastic TSOP (II)
⎯ Lead-free (RoHS compliant)
• Power supply: VDD, VDDQ = 2.5V ± 0.2V
• Data rate: 333Mbps/266Mbps (max.)
• Four internal banks for concurrent operation
• Interface: SSTL_2
• Burst lengths (BL): 2, 4, 8
• Burst type (BT):
⎯ Sequential (2, 4, 8)
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDDQ
LDQS
SF
VDD
NC
LDM
/WE
/CAS
/RAS
/CS
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
VSS
1
2
3
4
5
6
7
8
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
NC
VSSQ
UDQS
NC
VREF
VSS
UDM
/CK
CK
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
⎯ Interleave (2, 4, 8)
• /CAS Latency (CL): 2, 2.5
• Precharge: auto precharge operation for each burst
access
CKE
NC
A12
A11
A9
• Driver strength: normal/weak
NC
BA0
BA1
• Refresh: auto-refresh, super self-refresh with Auto
Temperature Compensated Self-refresh (ATCSR)
function
A10(AP) 28
A0 29
A1 30
A2 31
A3 32
VDD 33
39 A8
38 A7
37 A6
36 A5
35 A4
34 VSS
• Refresh cycles: 8192 cycles/64ms
⎯ Average refresh period: 7.8μs
• Operating ambient temperature range
⎯ TA = −40°C to +85°C
(Top view)
A0 to A12
BA0, BA1
Address input
Bank select address
Features
DQ0 to DQ15 Data-input/output
UDQS/LDQS Input and output data strobe
• Double-data-rate architecture; two data transfers per
clock cycle
/CS
Chip select
/RAS
/CAS
/WE
Row address strobe command
Column address strobe command
Write enable
• The high-speed data transfer is realized by the 2 bits
prefetch pipelined architecture
UDM/LDM
CK
Input mask
Clock input
• Bi-directional data strobe (DQS) is transmitted
/received with data for capturing data at the receiver
/CK
Differential clock input
Clock enable
CKE
VREF
VDD
VSS
VDDQ
VSSQ
NC
Input reference voltage
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
• DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK
transitions
SF
SSR Flag
• Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
• Data mask (DM) for write data
• SSR Flag function available
Document No. E0555E40 (Ver.4.0)
This product became EOL in April, 2007.
Date Published December 2005 (K) Japan
Printed in Japan
URL: http://www.elpida.com
©Elpida Memory, Inc. 2004-2005