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EDD2516AKTA-5B-E PDF预览

EDD2516AKTA-5B-E

更新时间: 2024-11-07 20:40:11
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
48页 438K
描述
DDR DRAM, 16MX16, 0.7ns, CMOS, PDSO66, PLASTIC, TSOP2-66

EDD2516AKTA-5B-E 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2,
针数:66Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.24
风险等级:5.34访问模式:FOUR BANK PAGE BURST
最长访问时间:0.7 ns其他特性:AUTO/SELF REFRESH
JESD-30 代码:R-PDSO-G66JESD-609代码:e6
长度:22.22 mm内存密度:268435456 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:66字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.5 V标称供电电压 (Vsup):2.6 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Bismuth (Sn/Bi)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

EDD2516AKTA-5B-E 数据手册

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PRELIMINARY DATA SHEET  
256M bits DDR SDRAM  
EDD2508AKTA-5 (32M words × 8 bits, DDR400)  
EDD2516AKTA-5 (16M words × 16 bits, DDR400)  
Description  
Pin Configurations  
The EDD2508AKTA-5 is a 256M bits DDR SDRAM  
/xxx indicates active low signal.  
organized as 8,388,608 words × 8 bits × 4 banks. The  
66-pin Plastic TSOP(II)  
EDD2516AKTA-5 is  
a 256M bits DDR SDRAM  
VDD  
DQ0  
VDD  
DQ0  
1
2
66  
VSS VSS  
DQ15 DQ7  
VSSQ VSSQ  
DQ14 NC  
DQ13 DQ6  
VDDQ VDDQ  
DQ12 NC  
DQ11 DQ5  
VSSQ VSSQ  
DQ10 NC  
DQ9 DQ4  
VDDQ VDDQ  
DQ8 NC  
organized as 4,194,304 words × 16 bits × 4 banks.  
Read and write operations are performed at the cross  
points of the CK and the /CK. This high-speed data  
transfer is realized by the 2 bits prefetch-pipelined  
architecture. Data strobe (DQS) both for read and  
write are available for high speed and reliable data bus  
design. By setting extended mode register, the on-chip  
Delay Locked Loop (DLL) can be set enable or disable.  
65  
64  
63  
62  
61  
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
VDDQ VDDQ  
3
NC  
DQ1  
DQ1  
DQ2  
4
5
VSSQ VSSQ  
6
NC  
DQ2  
DQ3  
DQ4  
7
8
VDDQ VDDQ  
9
NC  
DQ3  
VSSQ VSSQ  
NC  
NC  
VDDQ VDDQ  
NC LDQS  
NC  
VDD  
NC  
DQ5  
DQ6  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
It is packaged in 66-pin plastic TSOP (II).  
DQ7  
NC  
NC  
NC  
Features  
VSSQ VSSQ  
UDQS DQS  
NC  
NC  
VDD  
NC  
LDM  
/WE  
/CAS  
/RAS  
/CS  
Power supply: VDDQ = 2.6V ± 0.1V  
: VDD = 2.6V ± 0.1V  
Data rate: 400Mbps (max.)  
NC  
VREF VREF  
VSS VSS  
UDM DM  
/CK /CK  
NC  
/WE  
/CAS  
/RAS  
/CS  
NC  
BA0  
BA1  
Double Data Rate architecture; two data transfers per  
CK  
CKE CKE  
NC  
NC  
CK  
clock cycle  
Bi-directional, data strobe (DQS) is transmitted  
/received with data, to be used in capturing data at  
the receiver  
NC  
BA0  
BA1  
A12 A12  
A11 A11  
A9  
A8  
A7  
A6  
A5  
A4  
A9  
A8  
A7  
A6  
A5  
A4  
A10(AP) A10(AP)  
Data inputs, outputs, and DM are synchronized with  
A0  
A1  
A2  
A3  
VDD  
A0  
A1  
A2  
A3  
VDD  
DQS  
4 internal banks for concurrent operation  
DQS is edge aligned with data for READs; center  
VSS VSS  
aligned with data for WRITEs  
X 16  
X 8  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
(Top view)  
Commands entered on each positive CK edge; data  
A0 to A12  
BA0, BA1  
DQ0 to DQ15  
Address input  
Bank select address  
Data-input/output  
and data mask referenced to both edges of DQS  
Data mask (DM) for write data  
Auto precharge option for each burst access  
SSTL_2 compatible I/O  
Programmable burst length (BL): 2, 4, 8  
Programmable /CAS latency (CL): 3  
Programmable output driver strength: normal/weak  
Refresh cycles: 8192 refresh cycles/64ms  
7.8µs maximum average periodic refresh interval  
2 variations of refresh  
DQS, LDQS, UDQS Input and output data strobe  
/CS  
Chip select  
/RAS  
/CAS  
/WE  
DM, LDM, UDM  
CK  
/CK  
CKE  
VREF  
VDD  
VSS  
Row address strobe command  
Column address strobe command  
Write enable  
Input mask  
Clock input  
Differential clock input  
Clock enable  
Input reference voltage  
Power for internal circuit  
Ground for internal circuit  
Power for DQ circuit  
Ground for DQ circuit  
No connection  
VDDQ  
VSSQ  
NC  
Auto refresh  
Self refresh  
Document No. E0349E50 (Ver. 5.0)  
Date Published July 2004 (K) Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2003-2004  

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