DATA SHEET
256M bits DDR SDRAM
EDD2504AKTA-E (64M words × 4 bits)
Description
Pin Configurations
The EDD2504AKTA is a 256M bits Double Data Rate
(DDR) SDRAM organized as 16,777,216 words × 4 bits
× 4 banks. Read and write operations are performed at
the cross points of the CK and the /CK. This high-
speed data transfer is realized by the 2 bits prefetch-
pipelined architecture. Data strobe (DQS) both for
read and write are available for high speed and reliable
data bus design. By setting extended mode register,
the on-chip Delay Locked Loop (DLL) can be set
enable or disable. It is packaged in 66-pin plastic
TSOP (II).
/xxx indicates active low signal.
66-pin Plastic TSOP(II)
VDD
NC
VSS
NC
VSSQ
NC
DQ3
VDDQ
NC
1
2
66
65
64
63
62
61
60
59
VDDQ
NC
3
4
DQ0
VSSQ
NC
5
6
7
NC
NC
8
VDDQ
NC
DQ1
VSSQ
NC
NC
VDDQ
NC
9
58 VSSQ
NC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
DQ2
VDDQ
NC
Features
NC
• Power supply : VDDQ = 2.5V ± 0.2V
: VDD = 2.5V ± 0.2V
• Data rate: 333Mbps/266Mbps (max.)
VSSQ
DQS
NC
VREF
VSS
DM
/CK
CK
CKE
NC
A12
A11
A9
A8
A7
NC
VDD
NC
• Double Data Rate architecture; two data transfers per
clock cycle
NC
/WE
/CAS
/RAS
/CS
• Bi-directional, data strobe (DQS) is transmitted
/received with data, to be used in capturing data at
the receiver
• Data inputs, outputs, and DM are synchronized with
NC
BA0
BA1
A10(AP)
A0
DQS
• 4 internal banks for concurrent operation
• DQS is edge aligned with data for READs; center
A1
A2
A3
VDD
A6
A5
A4
VSS
aligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK
transitions
(Top view)
• Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
• Data mask (DM) for write data
• Auto precharge option for each burst access
• SSTL_2 compatible I/O
• Programmable burst length (BL): 2, 4, 8
• Programmable /CAS latency (CL): 2, 2.5
• Programmable output driver strength: normal/weak
• Refresh cycles: 8192 refresh cycles/64ms
7.8µs maximum average periodic refresh interval
• 2 variations of refresh
A0 to A12
BA0, BA1
DQ0 to DQ3
DQS
Address input
Bank select address
Data-input/output
Input and output data strobe
Chip select
Row address strobe command
Column address strobe command
Write enable
Input mask
Clock input
Differential clock input
Clock enable
Input reference voltage
Power for internal circuit
Ground for internal circuit
Power for DQ circuit
Ground for DQ circuit
No connection
/CS
/RAS
/CAS
/WE
DM
CK
/CK
CKE
VREF
VDD
VSS
Auto refresh
Self refresh
• TSOP (II) package with lead free solder (Sn-Bi)
VDDQ
VSSQ
NC
Document No. E0610E10 (Ver. 1.0)
Date Published November 2004 (K) Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2004