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EDD20323ABH-6ELS-F PDF预览

EDD20323ABH-6ELS-F

更新时间: 2024-11-07 21:09:59
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
59页 765K
描述
DDR DRAM, 64MX32, 5ns, CMOS, PBGA90, ROHS COMPLIANT, FBGA-90

EDD20323ABH-6ELS-F 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:90
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:5 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PBGA-B90
JESD-609代码:e1内存密度:2147483648 bit
内存集成电路类型:DDR DRAM内存宽度:32
功能数量:1端口数量:1
端子数量:90字数:67108864 words
字数代码:64000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:64MX32封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY认证状态:Not Qualified
自我刷新:YES最大供电电压 (Vsup):1.95 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

EDD20323ABH-6ELS-F 数据手册

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PRELIMINARY DATA SHEET  
2G bits DDR SDRAM  
WTR (Wide Temperature Range), Low Power Function  
EDD20323ABH-LS (64M words × 32 bits)  
Specifications  
Features  
Density: 2G bits  
Organization: 16M words × 32 bits × 4 banks  
DLL is not implemented  
Low power consumption  
Package: 90-ball FBGA  
Partial Array Self-Refresh (PASR)  
Lead-free (RoHS compliant) and Halogen-free  
Power supply: VDD, VDDQ = 1.7V to 1.95V  
Data rate: 400Mbps/333Mbps (max.)  
4KB page size  
Row address: A0 to A13  
Column address: A0 to A9  
Four internal banks for concurrent operation  
Interface: LVCMOS  
Burst lengths (BL): 2, 4, 8, 16  
Burst type (BT):  
Auto Temperature Compensated Self-Refresh  
(ATCSR) by built-in temperature sensor  
Deep power-down mode  
Double-data-rate architecture; two data transfers per  
one clock cycle  
The high-speed data transfer is realized by the 2 bits  
prefetch pipelined architecture  
Bi-directional data strobe (DQS) is transmitted  
/received with data for capturing data at the receiver.  
Data inputs, outputs, and DM are synchronized with  
DQS  
DQS is edge-aligned with data for READs; center-  
Sequential (2, 4, 8, 16)  
Interleave (2, 4, 8, 16)  
/CAS Latency (CL): 3  
aligned with data for WRITEs  
Differential clock inputs (CK and /CK)  
Commands entered on each positive CK edge: data  
Precharge: auto precharge option for each burst  
and data mask referenced to both edges of DQS  
access  
Data mask (DM) for write data  
Driver strength: normal, 3/4, 1/2, 1/4, 1/8  
Refresh: auto-refresh, self-refresh  
Refresh cycles: 8192 cycles/64ms  
Average refresh period: 7.8µs  
Operating ambient temperature range  
TA = 25°C to +85°C  
Burst termination by burst stop command and  
precharge command  
Wide temperature range  
TA = 25°C to +85°C  
Document No. E1437E20 (Ver. 2.0)  
Date Published January 2009 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2008-2009  

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