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ECQV1823JM PDF预览

ECQV1823JM

更新时间: 2024-11-25 22:37:11
品牌 Logo 应用领域
松下 - PANASONIC 电容器薄膜电容器
页数 文件大小 规格书
9页 245K
描述
Stacked Metallized Film Capacitor

ECQV1823JM 数据手册

 浏览型号ECQV1823JM的Datasheet PDF文件第2页浏览型号ECQV1823JM的Datasheet PDF文件第3页浏览型号ECQV1823JM的Datasheet PDF文件第4页浏览型号ECQV1823JM的Datasheet PDF文件第5页浏览型号ECQV1823JM的Datasheet PDF文件第6页浏览型号ECQV1823JM的Datasheet PDF文件第7页 
Stacked Metallized Film Capacitor  
Stacked Metallized Film Capacitor  
Type: ECQV  
Designed for application where high density insertion of  
components is required.  
Features  
High volumetric efficiency  
Excellent electrical characteristics in non-inductive  
construction  
Wide range for automatic insertion  
Recommended Applications  
General purpose usage  
Noise suppression for logic circuits  
Explanation of Part Numbers  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
C
Q
V
J
Product code  
Dielectric &  
construction  
Rated voltage  
Capacitance  
Taping  
Cap. Tol. Suffix  
Suffix  
50VDC 63VDC 100VDC  
1H 1J  
Crimped lead  
Ammo  
Reel  
1
Type1  
Type2  
Straight Crimped Straight Crimped  
style N style T  
W
2
3
5
9
Blank  
Specifications  
Category temp. range  
Rated voltage  
40 to +85˚C  
50VDC, 63VDC, 100VDC  
0.01 to 2.2 µF  
Capacitance range  
Capacitance tolerance  
Dissipation factor  
Withstand voltage  
5%(J)  
1.0%max.(20˚C 1kHz)  
Between terminals : Rated volt.(VDC)150% 60s  
<
C
0.33µF : 3000Mmin.  
20˚C, 50VDC 60s ECQV1H, ECQV1J  
20˚C, 100VDC 60s ECQV1  
=
Insulation resistance  
(
)
C>0.33µF : 1000M. µFmin.  
Dimensions in mm(not to scale)  
Type 1  
Lmax.  
Tmax.  
Type2(Suffix W)  
Style T  
Style N  
Marking  
Marking  
Marking  
F
0.8  
S
0.8  
S
0.8  
ø0.50 0.05  
Solder-plated Copper-clad  
steel-wire  
Packaging Specifications for Bulk Package  
Packing quantity:100pcs./bag  
Design and specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.  
Whenever a doubt about safety arises from this product, please contact us immediately for technical consultation.  

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