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EC30LA02 PDF预览

EC30LA02

更新时间: 2024-10-25 23:13:19
品牌 Logo 应用领域
NIEC 整流二极管肖特基二极管
页数 文件大小 规格书
6页 61K
描述
Schottky Barrier Diode

EC30LA02 数据手册

 浏览型号EC30LA02的Datasheet PDF文件第2页浏览型号EC30LA02的Datasheet PDF文件第3页浏览型号EC30LA02的Datasheet PDF文件第4页浏览型号EC30LA02的Datasheet PDF文件第5页浏览型号EC30LA02的Datasheet PDF文件第6页 
SBD  
T y p e : EC30LA02  
OUTLINE DRAWING  
FEATURES  
* Miniature Size,Surface Mount Device  
* Extremely Low Forward Voltage Drop  
* Low Power Loss,High Efficiency  
* High Surge Capability  
* Packaged in 12mm Tape and Reel  
* Not Rolling During Assembly  
Maximum Ratings  
Approx Net Weight:0.06g  
EC30LA02  
Rating  
Symbol  
Unit  
Repetitive Peak Reverse Voltage  
Repetitive Peak Surge Reverse Voltage  
VRRM  
VRRSM  
20  
V
V
25(pulse width 1µs duty 1/50)  
2.1  
Ta=25°C *1  
Tl=85°C Tl=Lead  
Temperature  
4.71  
50Hz Half Sine  
Wave Resistive  
Load  
Average Rectified Output Current  
Io  
A
3.0  
RMS Forward Current  
Surge Forward Current  
IF(RMS)  
IFSM  
A
A
50Hz Half Sine Wave,1cycle  
Non-repetitive  
50  
Operating JunctionTemperature Range  
Storage Temperature Range  
Tjw  
Tstg  
-40 to +125  
-40 to +125  
°C  
°C  
Electrical Thermal Characteristics  
Characteristics  
Symbol  
Conditions  
Min. Typ. Max.  
Unit  
Peak Reverse Current  
Peak Forward Voltage  
IRM  
VFM  
-
-
-
-
-
-
-
-
3
mA  
V
Tj= 25°C, VRM= VRRM  
Tj= 25°C, IFM= 3.0A  
Alumina Substrate mounted *1  
Rth(j-l) -  
0.39  
108  
23  
Thermal Junction to Ambient Rth(j-a)  
Resistance  
°C /W  
Junction to Lead  
*1: Alumina Substrate mounted (Soldering Lands=2x2mm,Both Sides)  
The curves of Average Forward Current vs. Temperature are the value that do not consider Reverse Power  
Dissipation.  
In actual use, consider the Reverse Power Dissipation to avoid thermal runaway of the diode.  

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