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EBJ81UG8EFU0-DJ-F PDF预览

EBJ81UG8EFU0-DJ-F

更新时间: 2024-02-01 06:36:10
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
18页 455K
描述
DDR DRAM Module, 2GX64, CMOS, HALOGEN FREE AND ROHS COMPLIANT, SODIMM-204

EBJ81UG8EFU0-DJ-F 技术参数

生命周期:Active包装说明:DIMM,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.75访问模式:DUAL BANK PAGE BURST
其他特性:SELF REFRESH; IT ALSO REQUIRES 1.5V NOM; WD-MAXJESD-30 代码:R-XZMA-N204
长度:67.6 mm内存密度:68719476736 bit
内存集成电路类型:DDR DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:204字数:1073741824 words
字数代码:1000000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1GX64封装主体材料:UNSPECIFIED
封装代码:DIMM封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY座面最大高度:30.15 mm
自我刷新:YES最大供电电压 (Vsup):1.45 V
最小供电电压 (Vsup):1.283 V标称供电电压 (Vsup):1.35 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:ZIG-ZAG宽度:3.8 mm
Base Number Matches:1

EBJ81UG8EFU0-DJ-F 数据手册

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COVER  
DATA SHEET  
8GB DDR3L SDRAM SO-DIMM  
EBJ81UG8EFU0 (1024M words 64 bits, 2 Ranks)  
Specifications  
Features  
• Density: 8GB  
• Organization  
• Double-data-rate architecture: two data transfers per  
clock cycle  
• The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
• Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
• DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
• Differential clock inputs (CK and /CK)  
• DLL aligns DQ and DQS transitions with CK transitions  
• Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
• Data mask (DM) for write data  
• Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
• On-Die-Termination (ODT) for better signal quality  
— Synchronous ODT  
— Dynamic ODT  
— Asynchronous ODT  
• Multi Purpose Register (MPR) for pre-defined pattern  
read out  
• ZQ calibration for DQ drive and ODT  
• Programmable Partial Array Self-Refresh (PASR)  
• /RESET pin for Power-up sequence and reset function  
• SRT range  
— Normal/extended  
• Programmable Output driver impedance control  
— 1024M words 64 bits, 2 ranks  
• Mounting 16 pieces of 4G bits DDR3L SDRAM sealed  
in FBGA  
• Package: 204-pin socket type small outline dual in-line  
memory module (SO-DIMM)  
— PCB height: 30.0mm  
— Lead pitch: 0.60mm  
— Lead-free (RoHS compliant) and Halogen-free  
• Power supply: 1.35V (typ)  
— VDD = 1.283V to 1.45V  
— Backward compatible for VDD = 1.5V 0.075V  
• Data rate: 1600Mbps/1333Mbps (max)  
• Backward compatible to 1066Mbps/800Mbps  
/667Mbps  
• Eight internal banks for concurrent operation  
(components)  
• Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
• /CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11  
• /CAS write latency (CWL): 5, 6, 7, 8  
• Precharge: auto precharge option for each burst  
access  
• Refresh: auto-refresh, self-refresh  
• Refresh cycles  
— Average refresh period  
7.8s at 0C TC +85C  
3.9s at +85C <TC +95C  
• Operating case temperature range  
— TC = 0C to +95C  
Document. No. E1937E30 (Ver. 3.0)  
Date Published November 2012 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2012  

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