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EBJ41RE4BAFA-DG-E PDF预览

EBJ41RE4BAFA-DG-E

更新时间: 2024-11-25 19:01:07
品牌 Logo 应用领域
尔必达 - ELPIDA 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
23页 228K
描述
DDR DRAM Module, 512MX72, 0.255ns, CMOS, ROHS COMPLIANT, DIMM-240

EBJ41RE4BAFA-DG-E 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:DIMM包装说明:DIMM, DIMM240,40
针数:240Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.36
风险等级:5.71Is Samacsys:N
访问模式:DUAL BANK PAGE BURST最长访问时间:0.255 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):667 MHz
I/O 类型:COMMONJESD-30 代码:R-XDMA-N240
JESD-609代码:e4内存密度:38654705664 bit
内存集成电路类型:DDR DRAM MODULE内存宽度:72
功能数量:1端口数量:1
端子数量:240字数:536870912 words
字数代码:512000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:
组织:512MX72输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM240,40封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5 V认证状态:Not Qualified
刷新周期:8192自我刷新:YES
子类别:Other Memory ICs最大供电电压 (Vsup):1.575 V
最小供电电压 (Vsup):1.425 V标称供电电压 (Vsup):1.5 V
表面贴装:NO技术:CMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:1 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

EBJ41RE4BAFA-DG-E 数据手册

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PRELIMINARY DATA SHEET  
4GB Registered DDR3 SDRAM DIMM  
EBJ41RE4BAFA (512M words × 72 bits, 2 Ranks)  
Specifications  
Features  
Density: 4GB  
Double-data-rate architecture; two data transfers per  
clock cycle  
Organization  
The high-speed data transfer is realized by the 8 bits  
prefetch pipelined architecture  
512M words × 72 bits, 2 ranks  
Mounting 36 pieces of 1G bits DDR3 SDRAM sealed  
in FBGA  
Bi-directional differential data strobe (DQS and /DQS)  
is transmitted/received with data for capturing data at  
the receiver  
Package: 240-pin socket type dual in line memory  
module (DIMM)  
DQS is edge-aligned with data for READs; center-  
aligned with data for WRITEs  
PCB height: 30.5mm (max.)  
Lead pitch: 1.0mm  
Differential clock inputs (CK and /CK)  
Lead-free (RoHS compliant)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Power supply: VDD = 1.5V ± 0.075V  
Data rate: 1333Mbps/1066Mbps/800Mbps (max.)  
Commands entered on each positive CK edge; data  
and data mask referenced to both edges of DQS  
Eight internal banks for concurrent operation  
(components)  
Posted /CAS by programmable additive latency for  
better command and data bus efficiency  
Interface: SSTL_15  
On-Die-Termination (ODT) for better signal quality  
Synchronous ODT  
Burst lengths (BL): 8 and 4 with Burst Chop (BC)  
/CAS Latency (CL): 5, 6, 7, 8, 9  
/CAS write latency (CWL): 5, 6, 7  
Dynamic ODT  
Asynchronous ODT  
Precharge: auto precharge option for each burst  
access  
Multi Purpose Register (MPR) for temperature read  
out  
Refresh: auto-refresh, self-refresh  
Refresh cycles  
ZQ calibration for DQ drive and ODT  
Programmable Partial Array Self-Refresh (PASR)  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
/RESET pin for Power-up sequence and reset  
function  
Operating case temperature range  
TC = 0°C to +95°C  
SRT range:  
Normal/extended  
Auto/manual self-refresh  
Programmable Output driver impedance control  
1 piece of registering clock driver and 1 piece of  
serial EEPROM (256 bytes EEPROM) for Presence  
Detect (PD)  
Class B temperature sensor functionality with  
EEPROM  
Document No. E1250E20 (Ver. 2.0)  
Date Published March 2008 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2007-2008  

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