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EBE51UD8ABFV PDF预览

EBE51UD8ABFV

更新时间: 2024-09-18 06:55:27
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
22页 225K
描述
512MB Unbuffered DDR2 SDRAM HYPER DIMM™

EBE51UD8ABFV 数据手册

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PRELIMINARY DATA SHEET  
512MB Unbuffered DDR2 SDRAM  
HYPER DIMM  
EBE51UD8ABFV (64M words × 64 bits, 1 Rank)  
Description  
Features  
The EBE51UD8ABFV is 64M words × 64 bits, 1 rank  
DDR2 SDRAM unbuffered module, mounting 8 pieces  
of 512M bits DDR2 SDRAM sealed in FBGA package.  
Read and write operations are performed at the cross  
points of the CK and the /CK. This high-speed data  
transfer is realized by the 4 bits prefetch-pipelined  
architecture. Data strobe (DQS and /DQS) both for  
read and write are available for high speed and reliable  
data bus design. By setting extended mode register,  
the on-chip Delay Locked Loop (DLL) can be set  
enable or disable. This module provides high density  
mounting without utilizing surface mount technology.  
Decoupling capacitors are mounted beside each FBGA  
on the module board.  
240-pin socket type dual in line memory module  
(DIMM)  
PCB height: 30.0mm  
Lead pitch: 1.0mm  
Lead-free  
1.85V power supply  
Data rate: 667Mbps/600Mbps (max.)  
SSTL_18 compatible I/O  
Double-data-rate architecture: two data transfers per  
clock cycle  
Bi-directional, differential data strobe (DQS and  
/DQS) is transmitted/received with data, to be used in  
capturing data at the receiver  
DQS is edge aligned with data for READs: center-  
aligned with data for WRITEs  
Note: Do not push the components or drop the  
modules in order to avoid mechanical defects,  
which may result in electrical defects.  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Four internal banks for concurrent operation  
(components)  
Data mask (DM) for write data  
Burst lengths: 4, 8  
/CAS Latency (CL): 3, 4, 5  
Auto precharge operation for each burst access  
Auto refresh and self refresh modes  
7.8µs average periodic refresh interval  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
/DQS can be disabled for single-ended Data Strobe  
operation  
Document No. E0528E12 (Ver. 1.2)  
This product became EOL in April, 2005.  
Date Published February 2006 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2004-2006  

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