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EBE51RD8AGFA PDF预览

EBE51RD8AGFA

更新时间: 2024-09-17 22:05:27
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
23页 193K
描述
512MB Registered DDR2 SDRAM DIMM (64M words x 72 bits, 1 Rank)

EBE51RD8AGFA 数据手册

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DATA SHEET  
512MB Registered DDR2 SDRAM DIMM  
EBE51RD8AGFA (64M words × 72 bits, 1 Rank)  
Description  
Features  
The EBE51RD8AGFA is a 64M words × 72 bits, 1 rank  
DDR2 SDRAM Module, mounting 9 pieces of DDR2  
SDRAM sealed in FBGA (µBGA) package. Read and  
write operations are performed at the cross points of  
the CK and the /CK. This high-speed data transfer is  
realized by the 4bits prefetch-pipelined architecture.  
Data strobe (DQS and /DQS) both for read and write  
are available for high speed and reliable data bus  
design. By setting extended mode register, the on-chip  
Delay Locked Loop (DLL) can be set enable or disable.  
This module provides high density mounting without  
240-pin socket type dual in line memory module  
(DIMM)  
PCB height: 30.0mm  
Lead pitch: 1.0mm  
Lead-free (RoHS compliant)  
Power supply: VDD = 1.8V ± 0.1V  
Data rate: 667Mbps/533Mbps/400Mbps (max.)  
SSTL_18 compatible I/O  
Double-data-rate architecture: two data transfers per  
clock cycle  
utilizing surface mount technology.  
capacitors are mounted beside each FBGA (µBGA) on  
the module board.  
Decoupling  
Bi-directional, data strobe (DQS and /DQS) is  
transmitted /received with data, to be used in  
capturing data at the receiver  
DQS is edge aligned with data for READs; center  
aligned with data for WRITEs  
Note: Do not push the components or drop the  
modules in order to avoid mechanical defects,  
which may result in electrical defects.  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge; data  
referenced to both edges of DQS  
Four internal banks for concurrent operation  
(components)  
Data mask (DM) for write data  
Burst length: 4, 8  
/CAS latency (CL): 3, 4, 5  
Auto precharge option for each burst access  
Auto refresh and self refresh modes  
Average refresh period  
7.8µs at 0°C TC ≤ +85°C  
3.9µs at +85°C < TC ≤ +95°C  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
/DQS can be disabled for single-ended Data Strobe  
operation  
1 piece of PLL clock driver, 1 pieces of register driver  
and 1 piece of serial EEPROM (2k bits EEPROM) for  
Presence Detect (PD)  
Document No. E0793E20 (Ver. 2.0)  
Date Published October 2005 (K) Japan  
Printed in Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2005  

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