Datasheet > EB52W4A15N-18.414M TR

EB52W4A15N-18.414M TR

更新时间： 2024-11-09 20:10:07

品牌	Logo	应用领域
日蚀 - ECLIPTEK		PC
页数	文件大小	规格书
4页	120K
描述
OSCILLATORS 1.5PPM 0+50 3.3V 4 18.414MHZ CMOS 18.3X21.3MM PCB SMD

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技术参数
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EB52W4A15N-18.414M TR 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.79	Base Number Matches：	1

EB52W4A15N-18.414M TR 数据手册

浏览型号EB52W4A15N-18.414M TR的Datasheet PDF文件第2页

EB52W4A15N-18.414M

EB52W4 A 15 N -18.414M

Series

Nominal Frequency

3.3Vdc LVCMOS PCB SMD TCXO

18.414MHz

Operating Temperature Range

0°C to +50°C

Control Voltage

None (No Connect on Pin 1)

Frequency Stability

±1.5ppm Maximum

ELECTRICAL SPECIFICATIONS

Nominal Frequency

18.414MHz

Frequency Stability

±1.5ppm Maximum (Inclusive of Operating Temperature Range)

Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)

Aging at 25°C

±1ppm/Year Maximum

Frequency Stability vs. Load

Operating Temperature Range

Supply Voltage

±0.2ppm Maximum (±2pF)

0°C to +50°C

3.3Vdc ±5%

Input Current

20mA Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

90% of Vdd Minimum

10% of Vdd Maximum

10nSec Maximum (Measured at 20% to 80% of waveform)

50% ±10% (Measured at 50% of waveform)

15pF Maximum

Duty Cycle

Load Drive Capability

Output Logic Type

Control Voltage

CMOS

None (No Connect on Pin 1)

±3ppm Minimum (Top of Can)

10kHz Minimum (Measured at -3dB with a Control Voltage of 1.65Vdc)

10kOhms Typical

Internal Trim

Modulation Bandwidth

Input Impedance

Phase Noise

-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -

145dBc at 100kHz Offset (Typical Values Fo=19.200MHz at 25°C at Nominal Vdd and Vc)

Storage Temperature Range

-40°C to +85°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)

Gross Leak Test

Lead Integrity

MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)

MIL-STD-883, Method 2004

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/16/2010 | Page 1 of 4

12 3 4

中文翻译

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