Datasheet > EB51F3B50N-24.576M

EB51F3B50N-24.576M

更新时间： 2024-01-15 03:07:21

品牌	Logo	应用领域
日蚀 - ECLIPTEK		/
页数	文件大小	规格书
5页	174K
描述
OSCILLATORS 5.0PPM 0+70 5.0V 4 24.576MHZ CMOS FULL 14PIN DIP

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EB51F3B50N-24.576M 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.79	Base Number Matches：	1

EB51F3B50N-24.576M 数据手册

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EB51F3B50N-24.576M

EB51F3 B 50 N -24.576M

Series

Nominal Frequency

5.0Vdc 14-Pin DIP HCMOS/TTL TCXO

24.576MHz

Operating Temperature Range

0°C to +70°C

Control Voltage

None (No Connect on Pin 1)

Frequency Stability

±5.0ppm Maximum

ELECTRICAL SPECIFICATIONS

Nominal Frequency

24.576MHz

Frequency Stability

±5.0ppm Maximum (Inclusive of Operating Temperature Range)

Frequency Stability vs. Input Voltage ±0.3ppm Maximum (±5%)

Aging at 25°C

±1ppm/Year Maximum

Frequency Stability vs. Load

Operating Temperature Range

Supply Voltage

±0.2ppm Maximum (±2pF)

0°C to +70°C

5.0Vdc ±5%

Input Current

30mA Maximum

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

2.4Vdc Minimum w/TTL Load, Vdd-0.5Vdc Minimum w/HCMOS Load

0.4Vdc Maximum w/TTL Load, 0.5Vdc Maximum w/HCMOS Load

10nSec Maximum (Measured at 0.4Vdc to 2.4Vdc w/TTL Load, 20% to 80% of waveform w/HCMOS Load)

50% ±10% (Measured at 1.4Vdc w/TTL Load, at 50% of waveform w/HCMOS Load)

10TTL Load or 15pF HCMOS Load Maximum

CMOS

Duty Cycle

Load Drive Capability

Output Logic Type

Control Voltage

None (No Connect on Pin 1)

Internal Trim

±3ppm Minimum (Top of Can)

Modulation Bandwidth

Input Impedance

10kHz Minimum (Measured at -3dB with a Control Voltage of 2.5Vdc)

10kOhms Typical

Phase Noise

-70dBc at 10Hz Offset, -100dBc at 100Hz Offset, -130dBc at 1kHz Offset, -140dBc at 10kHz Offset, -

145dBc at 100kHz Offset

Storage Temperature Range

-40°C to +85°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test

MIL-STD-883, Method 1014 Condition A (Internal Crystal Only)

Gross Leak Test

Lead Integrity

MIL-STD-883, Method 1014 Condition C (Internal Crystal Only)

MIL-STD-883, Method 2004

Mechanical Shock

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-202, Method 213 Condition C

MIL-STD-202, Method 210

MIL-STD-202, Method 215

MIL-STD-883, Method 2003

Temperature Cycling

Vibration

MIL-STD-883, Method 1010

MIL-STD-883, Method 2007 Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/16/2010 | Page 1 of 5

12 3 4 5

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