Datasheet > EABS2

EABS2

更新时间： 2022-02-26 13:13:24

品牌	Logo	应用领域
辰达行 - MDD		超快速恢复二极管
页数	文件大小	规格书
2页	348K
描述
GLASS PASSIVATED SUPER FAST RECOVERY BRIDGE RECTIFIERS

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数据手册

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EABS2 数据手册

EABS2 THRU EABS8

Voltage Range - 200 to 600 V olts Current - 0.8/1.0 Ampere

GLASS PASSIVATED SUPER FAST RECOVERY BRIDGE RECTIFIERS

Features

ABS



Ideal for printed circuit board

Reliable low cost construction utilizing molded plastic technique

High temperature soldering guaranteed: 260°/10 seconds at 5

lbs., (2.3kg) tension

Small size, simple installation



High surge current capability

Glass passivated chip junction

Mechanical Data

Case : JEDEC ABS Molded plastic body

Terminals : Solder plated, solderable per MIL-STD-750,Method 2026

Polarity : Polarity symbol marking on body

Mounting Position: Any

Weight

: 0.003 ounce, 0.098 grams

Dimensions in inches and (millimeters)

Maximum Ratings And Electrical Characteristics

Ratings at 25°C ambient temperature unle ss otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.

EABS2

EABS4

EABS6

EABS8

Parameter

UNITS

SYMBOLS

MDD

EABS2

EABS4

EABS6

EABS8

Marking Code

Maximum repetitive peak reverse voltage

Maximum RMS voltage

V^RRM

V^RMS

V^DC

100

200

140

200

400

280

400

600

420

600

Maximum DC blocking voltage

Maximum average forward rectified current

On glass-epoxy P.C.B.(Note1)

On aluminum substrate(Note2)

Peak forward surge current,

0.8

1.0

I^F(AV)

I^FSM

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

Maximum instantaneous forward voltage drop

per leg at 0.4A

0.95

1.25

1.7

V^F

I^R

500

Maximum DC reverse current

at rated DC blocking voltage

T^A=25°C

T^A=100°C

Rθ^JL

Rθ^JA

Typical thermal resistance

°C/W

Maximum reverse recovery time

Operating temperature range

storage temperature range

°C

trr

T^J

-55 to +150

T^STG

NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.

2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.

Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)

4.Reverse recovery condition IF=0.5A,IR=1.0A,Irr=0.25A.

copper pads.

DN:T19808A0

https://www.microdiode.com

Rev:2019A0

Page :1

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