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E7150-102A49-AG PDF预览

E7150-102A49-AG

更新时间: 2024-11-28 11:13:19
品牌 Logo 应用领域
安森美 - ONSEMI 无线
页数 文件大小 规格书
19页 572K
描述
音频处理器,用于助听器的无线功能 DSP

E7150-102A49-AG 数据手册

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EZAIRO 7150 SL HYBRID  
Wireless-Enabled Audio  
Processor for Digital  
Hearing Aids  
Introduction  
®
www.onsemi.com  
EZAIRO 7150 SL is an open−programmable DSP−based hybrid  
specifically designed for use in wirelessly connected,  
high−performance hearing aids and hearing implant devices. The  
Ezairo 7150 SL hybrid includes the Ezairo 7100 System−on−Chip  
(SoC) with its high−precision quad−core architecture that delivers 375  
MIPS, without sacrificing power consumption.  
The highly−integrated Ezairo 7100 includes an optimized,  
dual−Harvard CFX Digital Signal Processor (DSP) core and HEAR  
Configurable Accelerator signal processing engine. It also features an  
Arm Cortex −M3 Processor Subsystem that supports various types  
of protocols for wireless communication. This block combines an  
open−programmable controller with hardware accelerators for audio  
coding and error correction support.  
SIP49  
EZAIRO  
CASE 127DQ  
®
®
MARKING DIAGRAM  
Ezairo 7100 also includes a programmable Filter Engine that  
enables time domain filtering and supports an ultra−low−delay audio  
path. When combined with non−volatile memory and wireless  
transceivers, Ezairo 7100 forms a complete hardware platform.  
The Ezairo 7150 SL hybrid includes the nRF51822 wireless  
transceiver from Nordic Semiconductor. The nRF51822 is a powerful,  
E7150−102  
XXXXXX  
(Top View)  
E7150−102 = Specific Device Code  
XXXXXX = Work Order Number  
®
highly flexible multi−protocol SoC ideally suited for Bluetooth Low  
Energy (BLE) and 2.4 GHz ultra−low−power wireless applications.  
Ezairo 7150 SL also contains 2 Mb EEPROM storage and the  
necessary passive components to directly interface with the  
transducers required in a hearing aid.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
E7150−102A49−AG  
SIP49  
(Pb−Free)  
250 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
December, 2017 − Rev. 5  
E7150/D  

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