Datasheet > E401201

E401201

更新时间： 2024-11-24 12:24:39

品牌	Logo	应用领域
北陆电气 - HOKURIKU		/
页数	文件大小	规格书
2页	74K
描述
Double Sided (Silver / Copper) Polymer Through Hole Board

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E401201 数据手册

Double Sided (Silver / Copper) Polymer Through Hole Board

䂓Features

Significant cost reduction is possible by replacing copper plating through-hole PWB with polymer through-hole PWB.

High density circuit design is widely available.

Double sided surface mount PWB is available by using polymer through-hole PWB.

Highly reliable PWB is realized by using polymer through-holes on paper phenolic board.

䂓Construction

㽲

㽶

㽴

㽵

㽳

㽷

No.

Name

No.

㽵

㽶

㽷

Name

Solder Resist

(mm)

Base

Copper Foil

㽲

㽳

㽴

Covercoat & Marking

Through-hole Pitch

Through-hole

䂓Design Requirement

Through-hole Pitch:A

1.00

1.25

1.50

1.75

2.00

2.50

0.80 0.20 0.25 0.20 0.20

1.00 0.25 0.25 0.20 0.20

1.20 0.30 0.30 0.20 0.20

1.40 0.35 0.40 0.20 0.20

1.50 0.50 0.50 0.20 0.20

2.00 0.50 0.50 0.20 0.20

Through-hole

Copper Foil

䂓Specification

Specification

Item

Condition

AgTh

CuTh

Material of Base

Through-hole

FR-1, CEM-3

Conductive Resin

Copper paste through-hole pitch:

Min. 1.25mm

Silver Paste

Copper Paste

Ambient Temperature

-30 ~ +100㷄

Through-hole Resistance

Rated Current

100m㱅/hole

300mA/hole

50V *(20V)

100m㱅/hole

300mA/hole

100V

Less than 1.25mm pitch:250mA/hole

Different electric potential Voltage

(*Applied less than 1.25mm pitch)

70㷄 1000Hr

Max. Operation Voltage

Load Life

200m㱅/hole

Humidity Load Life

High Temperature

Humidity

40㷄 90~ 95%RH 1000Hr

100㷄 1000Hr

40㷄 90~ 95%RH 1000Hr

260㷄 5sec.

Solder Dipping

Reflow

240㷄 3sec.

Migration

40㷄 90~ 95%RH 1000Hr

260㷄 10sec 100 Cycle

-40㷄 100㷄 30min. 100 cycle

Oil Dipping

Heat Cycle

Specifications are subject to change without notice.

HOKURIKU

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