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E28F016XS-15 PDF预览

E28F016XS-15

更新时间: 2024-01-14 06:33:16
品牌 Logo 应用领域
英特尔 - INTEL 闪存存储内存集成电路光电二极管
页数 文件大小 规格书
54页 1262K
描述
16-MBIT (1 MBIT x 16, 2 MBIT x 8) SYNCHRONOUS FLASH MEMORY

E28F016XS-15 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP1包装说明:TSOP1, TSSOP56,.8,20
针数:56Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.8Is Samacsys:N
最长访问时间:20 ns其他特性:ALSO CAN BE CONFIGURED AS 1M X 16
备用内存宽度:8命令用户界面:YES
数据轮询:NOJESD-30 代码:R-PDSO-G56
JESD-609代码:e0长度:18.4 mm
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:16端子数量:56
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装等效代码:TSSOP56,.8,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL电源:3.3/5 V
编程电压:5 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:128K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.175 mA
最大供电电压 (Vsup):5.25 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:MOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
切换位:NO类型:NOR TYPE
宽度:14 mmBase Number Matches:1

E28F016XS-15 数据手册

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E
28F016XS  
16-MBIT (1 MBIT x 16, 2 MBIT x 8)  
SYNCHRONOUS FLASH MEMORY  
Effective Zero Wait-State Performance  
up to 33 MHz  
Synchronous Pipelined Reads  
Backwards-Compatible with 28F008SA  
Command-Set  
2 µA Typical Deep Power-Down  
SmartVoltage Technology  
1 mA Typical Active ICC Current in  
Static Mode  
User-Selectable 3.3V or 5V VCC  
User-Selectable 5V or 12V VPP  
16 Separately-Erasable/Lockable  
128-Kbyte Blocks  
0.33 MB/sec Write Transfer Rate  
Configurable x8 or x16 Operation  
1 Million Erase Cycles per Block  
56-Lead TSOP and SSOP Type I  
Package  
State-of-the-Art 0.6 µm ETOX™ IV Flash  
Technology  
Intel’s 28F016XS 16-Mbit flash memory is a revolutionary architecture which is the ideal choice for designing  
truly revolutionary high-performance products. Combining very high read performance with the intrinsic  
nonvolatility of flash memory, the 28F016XS eliminates the traditional redundant memory paradigm of  
shadowing code from a slow nonvolatile storage source to a faster execution memory, such as DRAM, for  
improved system performance. The innovative capabilities of the 28F016XS enable the design of direct-  
execute code and mass storage data/file flash memory systems.  
The 28F016XS is the highest performance high-density nonvolatile read/program flash memory solution  
available today. Its synchronous pipelined read interface, flexible VCC and VPP voltages, extended cycling,  
fast program and read performance, symmetrically-blocked architecture, and selective block locking provide a  
highly flexible memory component suitable for resident flash component arrays on the system board or  
SIMMs. The synchronous pipelined interface and x8/x16 architecture of the 28F016XS allow easy interface  
with minimal glue logic to a wide range of processors/buses, providing effective zero wait-state read  
performance up to 33 MHz. The 28F016XS’s dual read voltage allows the same component to operate at  
either 3.3V or 5.0V VCC. Programming voltage at 5V VPP minimizes external circuitry in minimal-chip, space  
critical designs, while the 12.0V VPP option maximizes program/erase performance. Its high read performance  
combined with flexible block locking enable both storage and execution of operating systems/application  
software and fast access to large data tables. The 28F016XS is manufactured on Intel’s 0.6 µm ETOX IV  
process technology.  
November 1996  
Order Number: 290532-004  

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