Datasheet > DZL4730

DZL4730

更新时间： 2022-02-26 12:19:26

品牌	Logo	应用领域
鲁光 - LGE		/
页数	文件大小	规格书
2页	998K
描述
Glass Passivated Zener

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数据手册

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DZL4730 数据手册

DZL4728 thru DZL4764

Glass Passivated Zener

SOD-123FL

Features

For surface mounted applications in

ꢀ

order to optimize board space

0.075(1.90)

0.067(1.70)

0.043(1.09)

0.035(0.89)

Low profile space

ꢀ

Glass passivated chip

ꢀ

0.114(2.9)

0.098(2.5)

High reliability

ꢀ

For use in stabilizing and clipping

ꢀ

0.008(0.20)

0.004(0.10)

circuits with high power rating.

0.047(1.19)

0.043(1.09)

Component in accordance to

ꢀ

RoHS 2002/95/EC and WEEE 2002/96/EC

0.030(0.76)

0.018(0.45)

Mechanical Date

Case: JEDEC SOD-123FL molded plastic

ꢀ

over passivated chip

0.154(3.9)

Terminals: Solder plated, solderable per

ꢀ

0.138(3.5)

MIL-STD-750 Method 2026

Dimensions in inches and(millimeters)

Polarity: types the band by laser

ꢀ

denotes the cathode

Weight: 0.017gram

ꢀ

Applications

Voltage stabilization

ꢀ

Maximum Ratings & Thermal Characteristics

(T_A= 25 °C unless otherwise noted)

VALUE

1.0

Symbol

UNIT

power dissipation

Typical thermal resistance, junction to ambient

Typical thermal resistance, junction to lead

Junction temperature

R_θJA

R_θJL

°C / W

°C

150

storage temperature range

T_STG

–55 to +150

°C

Fig. 1

Fig. 2

POWER TEMPERATURE

DERATING CURVE

TYPICAL THERMAL RESISTANCE

VERSUS LEAD LENGTH

1.2

175

150

125

100

0.8

0.6

0.4

0.2

100

150

0.01

1.0

100

0.1

AMBIENT TEMPERATURE, Ta(oC)

PULSE DURATION, (sec)

http://www.lgesemi.com

mail:lge@lgesemi.com

Revision:20170701-P1

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