DTS6401
www.din-tek.jp
Power MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
• Isolated Package
- 60
Available
• High Voltage Isolation = 2.5 kVRMS (t = 60 s;
f = 60 Hz)
RDS(on) (Ω)
VGS = - 10 V
0.40
RoHS*
COMPLIANT
• Sink to Lead Creepage Distance = 4.8 mm
• P-Channel
• 175 °C Operating Temperature
• Dynamic dV/dt Rating
Qg (Max.) (nC)
12
3.8
Q
Q
gs (nC)
gd (nC)
5.1
Configuration
Single
• Low Thermal Resistance
• Lead (Pb)-free Available
TO-236
(SOT-23)
S
G
S
1
2
G
3
D
D
P-Channel MOSFET
Top View
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
- 60
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
20
T
C = 25 °C
- 5.2
- 3.8
- 21
Continuous Drain Current
VGS at - 10 V
ID
A
TC =100°C
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.18
120
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
- 5.2
2.7
EAR
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
27
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
- 4.5
- 55 to + 175
300d
10
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
°C
for 10 s
lbf · in
N · m
Mounting Torque
6-32 or M3 screw
1.1
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 5.0 mH, RG = 25 Ω, IAS = - 5.3 A (see fig. 12).
c. ISD ≤ - 6.7 A, dI/dt ≤ 90 A/µs, VDD ≤ VDS, TJ ≤ 175 °C.
d. 1.6 mm from case.
1