DTL1N60/DTP1N60/DTU1N60
www.din-tek.jp
Power MOSFET
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
PRODUCT SUMMARY
VDS (V)
600
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Available in Tape and Reel
• Fast Switching
R
DS(on) (Ω)
VGS = 10 V
7
Qg (Max.) (nC)
Qgs (nC)
14
2.7
Q
gd (nC)
8.1
• Ease of Paralleling
• Compliant to RoHS Directive 2002/95/EC
Configuration
Single
TO-220AB
D
DPAK
IPAK
(TO-252)
(TO-251)
D
D
G
S
G
S
D
G
S
G D
S
N-Channel MOSFET
Top View
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
600
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
T
C = 25 °C
1.4
Continuous Drain Current
VGS at 10 V
ID
TC = 100 °C
0.89
A
Pulsed Drain Currenta
IDM5.6
Linear Derating Factor
0.28
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
0.020
EAS
IAR
93
mJ
A
1.4
Repetitive Avalanche Energya
EAR
3.6
36
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
3.8
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 37 mH, Rg = 25 Ω, IAS = 1.4 A (see fig. 12).
c. ISD ≤1.4 A, dI/dt ≤ 40 A/μs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
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