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DTC3058_13 PDF预览

DTC3058_13

更新时间: 2024-02-26 20:01:25
品牌 Logo 应用领域
鼎日 - DINTEK /
页数 文件大小 规格书
8页 1728K
描述
N-Channel 30-V (D-S) MOSFET Halogen-free

DTC3058_13 数据手册

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DTC3058  
www.din-tek.jp  
N-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
6.8  
TrenchFET® Power MOSFET  
0.033 at VGS = 4.5 V  
0.045 at VGS = 2.5 V  
RoHS  
30  
10 nC  
COMPLIANT  
APPLICATIONS  
6.8  
Load Switches for Portable Devices  
D
D
G
S
G
D
S
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
30  
20  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
6.8a  
6
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
a
Continuous Drain Current (TJ = 150 °C)  
ID  
6.8a, b, c  
6 a, b, c  
30  
A
Pulsed Drain Current  
IDM  
IS  
5.2  
2.1b, c  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
T
C = 25 °C  
TC = 70 °C  
A = 25 °C  
TA = 70 °C  
6.3  
4
2.5b, c  
1.6b, c  
PD  
Maximum Power Dissipation  
W
T
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)e, f  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJF  
Typical  
40  
Maximum  
Unit  
Maximum Junction-to-Ambienta, c, d  
t 5 s  
Steady State  
50  
°C/W  
Maximum Junction-to-Foot (Drain)  
15  
20  
Notes:  
a. Package limited, TC = 25 °C.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. Maximum under Steady State conditions is 95 °C/W.  
e. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result  
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure  
adequate bottom side solder interconnection.  
f. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
1

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