DTA114EET1 Series
Preferred Devices
Bias Resistor Transistors
PNP Silicon Surface Mount Transistors
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The Bias Resistor
Transistor (BRT) contains a single transistor with a monolithic bias
network consisting of two resistors; a series base resistor and a
base−emitter resistor. The BRT eliminates these individual
components by integrating them into a single device. The use of a BRT
can reduce both system cost and board space. The device is housed in
the SC−75/SOT−416 package which is designed for low power
surface mount applications.
http://onsemi.com
PNP SILICON BIAS
RESISTOR TRANSISTORS
PIN 3
COLLECTOR
(OUTPUT)
PIN 1
R1
Features
BASE
(INPUT)
R2
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
PIN 2
EMITTER
(GROUND)
• The SC−75/SOT−416 package can be soldered using wave or reflow.
The modified gull−winged leads absorb thermal stress during
soldering eliminating the possibility of damage to the die.
• Pb−Free Packages are Available
3
2
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
A
Rating
Collector-Base Voltage
Symbol
Value
50
Unit
Vdc
SC−75 (SOT−416)
CASE 463
V
V
CBO
CEO
STYLE 1
Collector-Emitter Voltage
Collector Current
50
Vdc
I
100
mAdc
C
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Total Device Dissipation, FR−4 Board
P
D
(Note 1) @ T = 25°C
Derate above 25°C
200
1.6
mW
mW/°C
A
xx M G
G
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
q
JA
600
°C/W
Total Device Dissipation, FR−4 Board
P
D
xx
=
Specific Device Code
xx = (Refer to page 2)
Date Code*
(Note 2) @ T = 25°C
Derate above 25°C
300
2.4
mW
mW/°C
A
M
G
=
=
Thermal Resistance, Junction−to−Ambient
(Note 2)
R
q
JA
400
°C/W
Pb−Free Package
(Note: Microdot may be in either location)
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
*Date Code orientation may vary depending
upon manufacturing location.
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
2. FR−4 @ 1.0 × 1.0 Inch Pad.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 6
DTA114EET1/D