DSR03A - DSR03M
SURFACE MOUNT RECTIFIER DIODES
VOLTAGE RANGE: 50 - 1000V
CURRENT: 0.3 A
Features
Low profile space
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Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature solder:ing
260℃/10 seconds at terminals
B
C
E
SOD-123FL
Dim Min Max
Mechanical Data
Typ
3.58 3.72 3.65
2.72 2.78 2.75
1.77 1.83 1.80
1.02 1.08 1.05
0.097 1.03 1.00
0.13 0.17 0.15
0.53 0.57 0.55
A
B
C
D
E
H
L
: JEDEC SOD-123FL molded
plastic body over passivated chip
Case
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D
H
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Terminals
solderable per MIL-STD-750,
: Plated axial leads,
Method 2026
L
Polarity
: Color band denotes cathode end
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All Dimensions in mm
Mounting Position
: Any
E
Weight
:0.0007 ounce, 0.02 grams
A
Maximum Ratings and Electrical Characteristics
TA = 25ꢀC unless otherwise specified
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
DSR
03A
DSR
03B
DSR
03D
DSR
03G
DSR
03J
DSR
03K
DSR
03M
Symbol
Unit
Characteristic
Maximum repetitive peak reverse voltage
Maximum RMS voltage
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
50
35
50
VRRM
V
V
V
VRMS
Maximum DC blocking voltage
100
1000
VDC
Maximum average forward rectified current
at TA=65 C (NOTE 1)
I(AV)
0.3
A
Peak forward surge current
IFSM
15.0
1.1
8.3ms single half sine-wave superimposed on
A
V
rated load (JEDEC Method)
TL=25 C
VF
IR
Maximum instantaneous forward voltage at 0.3A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
50.0
µ
A
TA=100 C
Typical junction capacitance (NOTE 2)
Typical thermal resistance (NOTE 3)
CJ
pF
K/W
C
4
RθJA
220
,
TJ TSTG
-55 to +150
Operating junction and storage temperature range
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (
μm thick)
≈35
1 of 2
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