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DSPIC33EP256MC506-E/PT PDF预览

DSPIC33EP256MC506-E/PT

更新时间: 2024-09-24 13:07:27
品牌 Logo 应用领域
美国微芯 - MICROCHIP 微控制器运算放大器
页数 文件大小 规格书
526页 5131K
描述
16-BIT, FLASH, 60 MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, TQFP-64

DSPIC33EP256MC506-E/PT 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:TFQFP, TQFP64,.47SQ
针数:64Reach Compliance Code:compliant
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
Factory Lead Time:8 weeks风险等级:1.5
具有ADC:YES地址总线宽度:
位大小:16最大时钟频率:60 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:格式:FLOATING POINT
JESD-30 代码:S-PQFP-G64JESD-609代码:e3
长度:10 mm湿度敏感等级:3
I/O 线路数量:53端子数量:64
片上程序ROM宽度:24最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:TFQFP
封装等效代码:TQFP64,.47SQ封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
RAM(字节):32768RAM(字数):16384
ROM(单词):87381ROM可编程性:FLASH
座面最大高度:1.2 mm速度:60 MHz
子类别:Digital Signal Processors最大压摆率:60 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:10 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

DSPIC33EP256MC506-E/PT 数据手册

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