Datasheet > DSILC6-4P6

DSILC6-4P6

更新时间： 2024-01-29 18:38:26

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
11页	355K
描述
ESD Protection for high speed interface

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中文翻译

获取价格

数据手册
替代型号

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DSILC6-4P6 数据手册

DSILC6-4xx

ESD Protection for high speed interface

Main applications

I/O3

VCC

Where transient over-voltage protection in ESD

sensitive equipment is required, such as:

I/O4

I/O2

GND

I/O1

■ Computers

■ Printers

SOT-666

DSILC6-4P6

Flip-Chip

DSILC6-4F2

■ Communication systems

■ Cell phone handsets and accessories

■ Video equipment

Functional diagram

I/O3

Description

I/O4

VCC

I/O1

VCC

I/O2

The DSILC6-4xx is a monolithic application

specific discrete dedicated to ESD protection of

high speed interfaces, such as USB 2.0, Ethernet,

display and camera serial interfaces (LVDS).

I/O4

GND

I/O3

I/O2

GND

I/O1

The device is ideal for applications where both

reduced printed circuit board space and power

absorption capability are required.

SOT-666

Top-side view

Flip-Chip

Top-side view

Features

I/O2

I/O3

I/O1 VCC

I/O4 GND

Diode array topology

■ 4 line protection

Flip-Chip

Top-side view

■ 5 V V protection

■ Very low capacitance: 1 pF typ.

■ Lead-free pacakge

■ RoHS compliant

Order Code

Part Number

Marking

Benefits

DSILC6-4P6

DSILC6-4F2

■ Very low capacitance between lines to GND for

optimized data integrity

■ Low PCB space consumption: 2.9 mm² max for

Complies with the following standards:

SOT-666 and 1.5 mm² max for Flip-Chip

■ Cut-off frequency > 2 GHz

IEC 61000-4-2 level 4:

■ High reliability offered by monolithic integration

■ MDDI, SMIA, MIPI specification compliant

8 kV (contact discharge)

15 kV (air discharge)

MIL STD 883G-Method 3015-7: class 3B

May 2007

Rev 3

1/11

www.st.com

12 3 4 5 6 7...11

中文翻译

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DSILC6-4P6 替代型号

型号	品牌	替代类型	描述	数据表
USBLC6-2P6	STMICROELECTRONICS	类似代替	VERY LOW CAPACITANCE ESD PROTECTION
TPD4E002DRLR	TI	功能相似	QUAD LOW-CAPACITANCE ARRAY WITH ±15-kV ESD PR

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