DSF0.5F

更新时间： 2024-11-21 12:23:59

品牌	Logo	应用领域
鲁光 - LGE		/
页数	文件大小	规格书
2页	431K
描述
Surface Mount Superfast Rectifiers

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中文翻译

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数据手册

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DSF0.5F 数据手册

DSF0.5A-DSF0.5K

Surface Mount Superfast Rectifiers

Features

SOD-123FL

●

Low profile space

Ideal for automated placement

Glass passivated chip junctions

Low forward voltage drop

Cathode Band

Top View

Low leakage current

2.8±0.1

High forward surge capability

High temperature soldering：

260℃/10 seconds at terminals

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

0.6±0.25

●

Mechanical Date

3.7±0.2

●

Case: JEDEC SOD-123FL molded plastic

body over glass passivated chip

Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

Polarity: Laser band denotes cathode end

Weight: 0.017gram

●

Dimensions in millimeters

●

Maximum Ratings & Thermal Characteristics & Electrical Characteristics

(T_A= 25 °C unless otherwise noted)

DSF-

Symbol

0.5A

0.5B

0.5C

0.5D

0.5F

0.5G

UNIT

Maximum repetitive peak reverse voltage

Maximum RMS voltage

V_RRM

V_RMS

V_DC

100

150

105

150

200

140

200

300

210

300

400

280

400

Maximum DC blocking voltage

100

Maximum average forward rectified current

I_F(AV)

0.5

Peak forward surge current 8.3 ms single half sine-

wave superimposed on rated load

I_FSM

V_F

I_R

Maximum instantaneous forward voltage at 0.5A

0.95

1.25

Maximum DC reverse current

at Rated DC blocking voltage

T_A= 25 ℃

T_A= 100℃

5.0

100

μA

Maximum reverse recovery time

at I_F= 0.5 A , I_R= 1.0 A , I_rr= 0.25 A

t_rr

Typical thermal resistance

R_θJA

150

℃/W

Operating junction and storage temperature range

T_J, T_STG

–55 to +150

℃

Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35 μm thick)

http://www.luguang.cn

mail:lge@luguang.cn

中文翻译

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