DSF0.5A-DSF0.5K
Surface Mount Superfast Rectifiers
Features
SOD-123FL
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Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Cathode Band
Top View
Low leakage current
2.8±0.1
High forward surge capability
High temperature soldering:
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
0.6±0.25
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Mechanical Date
3.7±0.2
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Case: JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Laser band denotes cathode end
Weight: 0.017gram
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Dimensions in millimeters
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Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(TA = 25 °C unless otherwise noted)
DSF-
Symbol
0.5A
0.5B
0.5C
0.5D
0.5F
0.5G
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
50
35
50
100
70
150
105
150
200
140
200
300
210
300
400
280
400
V
V
V
A
Maximum DC blocking voltage
100
Maximum average forward rectified current
IF(AV)
0.5
15
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
IFSM
VF
IR
A
V
Maximum instantaneous forward voltage at 0.5A
0.95
1.25
Maximum DC reverse current
at Rated DC blocking voltage
TA = 25 ℃
TA = 100℃
5.0
100
μA
Maximum reverse recovery time
at IF = 0.5 A , IR = 1.0 A , Irr = 0.25 A
trr
35
nS
Typical thermal resistance
RθJA
150
℃/W
Operating junction and storage temperature range
TJ, TSTG
–55 to +150
℃
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35 μm thick)
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