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DS90CF384 PDF预览

DS90CF384

更新时间: 2024-11-08 22:50:51
品牌 Logo 应用领域
美国国家半导体 - NSC 显示器光电二极管
页数 文件大小 规格书
20页 368K
描述
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link-65 MHz

DS90CF384 数据手册

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November 2000  
DS90C383/DS90CF384  
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel  
Display (FPD) Link—65 MHz, +3.3V LVDS Receiver  
24-Bit Flat Panel Display (FPD) Link—65 MHz  
General Description  
Features  
n 20 to 65 MHz shift clock support  
n Programmable transmitter (DS90C383) strobe select  
(Rising or Falling edge strobe)  
The DS90C383 transmitter converts 28 bits of LVCMOS/  
LVTTL data into four LVDS (Low Voltage Differential Signal-  
ing) data streams. A phase-locked transmit clock is transmit-  
ted in parallel with the data streams over a fifth LVDS link.  
Every cycle of the transmit clock 28 bits of input data are  
sampled and transmitted. The DS90CF384 receiver con-  
verts the LVDS data streams back into 28 bits of LVCMOS/  
LVTTL data. At a transmit clock frequency of 65 MHz, 24 bits  
of RGB data and 3 bits of LCD timing and control data  
(FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455  
Mbps per LVDS data channel. Using a 65 MHz clock, the  
data throughputs is 227 Mbytes/sec. The transmitter is of-  
fered with programmable edge data strobes for convenient  
interface with a variety of graphics controllers. The transmit-  
ter can be programmed for Rising edge strobe or Falling  
edge strobe through a dedicated pin. A Rising edge trans-  
n Single 3.3V supply  
n Chipset (Tx + Rx) power consumption 250 mW (typ)  
n Power-down mode ( 0.5 mW total)  
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n Single pixel per clock XGA (1024x768) ready  
n Supports VGA, SVGA, XGA and higher addressability.  
n Up to 227 Megabytes/sec bandwidth  
n Up to 1.8 Gbps throughput  
n Narrow bus reduces cable size and cost  
n 290 mV swing LVDS devices for low EMI  
n PLL requires no external components  
n Low profile 56-lead TSSOP package.  
n Also available in a 64 ball, 0.8mm fine pitch ball grid  
array (FBGA) package  
mitter will inter-operate with  
a Falling edge receiver  
(DS90CF384) without any translation logic. Both devices are  
also offered in a 64 ball, 0.8mm fine pitch ball grid array  
(FBGA) package which provides a 44 % reduction in PCB  
footprint compared to the TSSOP package.  
n Falling edge data strobe Receiver  
n Compatible with TIA/EIA-644 LVDS standard  
>
n ESD rating 7 kV  
n Operating Temperature: −40˚C to +85˚C  
This chipset is an ideal means to solve EMI and cable size  
problems associated with wide, high speed TTL interfaces.  
Block Diagrams  
Typical Application  
DS012887-2  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2000 National Semiconductor Corporation  
DS012887  
www.national.com  

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