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DS88L12J/A+ PDF预览

DS88L12J/A+

更新时间: 2024-11-26 21:19:47
品牌 Logo 应用领域
美国国家半导体 - NSC 逻辑集成电路
页数 文件大小 规格书
3页 75K
描述
IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC

DS88L12J/A+ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP14,.3Reach Compliance Code:unknown
风险等级:5.92JESD-30 代码:R-XDIP-T14
JESD-609代码:e0逻辑集成电路类型:LOGIC CIRCUIT
端子数量:14最高工作温度:70 °C
最低工作温度:封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP14,.3
封装形状:RECTANGULAR封装形式:IN-LINE
子类别:Gates表面贴装:NO
技术:BIPOLAR温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

DS88L12J/A+ 数据手册

 浏览型号DS88L12J/A+的Datasheet PDF文件第2页浏览型号DS88L12J/A+的Datasheet PDF文件第3页 
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