Datasheet > DS3900H2

DS3900H2

更新时间： 2024-11-22 12:27:35

品牌	Logo	应用领域
美信 - MAXIM		通信
页数	文件大小	规格书
14页	1443K
描述
USB HID Communications Module for Evaluation Kits

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DS3900H2 数据手册

DS3900H2

USB HID Communications Module for

Evaluation Kits

General Description

The DS3900H2 evaluation kit (EV kit) component provides

bidirectional communication with I C- and SPI-compatible

Features

●ꢀ CommunicatesꢀfromꢀPCsꢀtoꢀICsꢀThroughꢀaꢀUSBꢀPortꢀ

Using the Human Interface Device (HID) Class

devices using a PC’s USB port. In addition, the EV kit can

also be used as a general-purpose digital I/O interface

with 11 I/O signals that can evaluate a variety of ICs.

●ꢀ FastꢀCommunicationꢀtoꢀI C- and SPI-Compatible

Devices

●ꢀ 11ꢀTotalꢀGeneral-PurposeꢀDigitalꢀI/OꢀPins,ꢀIncludingꢀ

AllꢀCommunicationꢀProtocolꢀPins

The DS3900H2 IC is a small form-factor module that

requires appropriate headers to pass communication

signals to the device under test. The IC is intended

to interface with approved HID-compliant PC software

evaluation purposes only.

●ꢀ Built-InꢀPullupꢀResistorsꢀforꢀSDAꢀandꢀSCLꢀMinimizeꢀ

RequiredꢀExternalꢀHardware

●ꢀ ConnectionꢀtoꢀStandardꢀPrototypingꢀBoardsꢀPossibleꢀ

Using Header Connectors

●ꢀ Operatesꢀfromꢀ+2.5Vꢀtoꢀ+5.5V

Ev Kit Contents

●ꢀ AssembledꢀDS3900H2ꢀCircuitꢀBoard

●ꢀ USBꢀHIDꢀInterfaceꢀforꢀWindowsꢀXP^®-,ꢀWindowsꢀ

Vista^®-,ꢀandꢀWindows^®7-Compatible Software

●ꢀ Mini-USBꢀCable

●ꢀ RoHSꢀCompliant

●ꢀ FullyꢀAssembledꢀandꢀTestedꢀProvenꢀPCBꢀLayout

Ordering Information appears at end of data sheet.

DS3900H2 EV Kit Photo

Windows, Windows XP, and Windows Vista are registered

trademarks and registered service marks of Microsoft

Corporation.

19-6733; Rev 0; 6/13

12 3 4 5 6 7...14

中文翻译

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与DS3900H2相关器件

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