是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 316 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.72 | JESD-30 代码: | S-PBGA-B316 |
JESD-609代码: | e0 | 长度: | 27 mm |
功能数量: | 1 | 端子数量: | 316 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 225 | 认证状态: | Not Qualified |
座面最大高度: | 2.53 mm | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
电信集成电路类型: | FRAMER | 温度等级: | INDUSTRIAL |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 27 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
DS31256 | MAXIM |
获取价格 |
256-Channel, High-Throughput HDLC Controller | |
DS31256_V01 | MAXIM |
获取价格 |
256-Channel, High-Throughput HDLC Controller | |
DS31256+ | MAXIM |
获取价格 |
256-Channel, High-Throughput HDLC Controller | |
DS31256+T | MAXIM |
获取价格 |
Telecom Circuit, | |
DS31256B | ROCHESTER |
获取价格 |
SPECIALTY TELECOM CIRCUIT, PBGA256, 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-256 | |
DS31256B | MAXIM |
获取价格 |
Telecom Circuit, 1-Func, CMOS, PBGA256, 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-256 | |
DS31256DK | ETC |
获取价格 |
256-Channel.High-Throughput HDLC Controller Demo Kit | |
DS312BNC | ETC |
获取价格 |
Industrial Control IC | |
DS-312BNC | TE |
获取价格 |
Four-Way Power Dividers 10 - 500 MHz | |
DS-312-BNC | MACOM |
获取价格 |
(non-RoHS) 4-Way |