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DS31 PDF预览

DS31

更新时间: 2024-01-16 23:16:35
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描述
Lumileds P3 Series TS AlInGaP Chips

DS31 数据手册

 浏览型号DS31的Datasheet PDF文件第2页 
HWFRꢀB310  
HWFRꢀB410  
HWFRꢀB510  
Lumileds P3 Series  
TS AlInGaP  
Chips  
Technical Data DS31  
P3 Series transperent substrate AlInGaP chips  
deliver high flux performance.  
Benefits  
Outline Drawings  
Fewer LEDs Required  
Al Bond Pad  
Lowers Lighting System Cost  
Au/Zn Contact  
P-type GaP Window  
P-type AlInGaP UCL  
Multi-well Active Region  
N-typeAlInGaP LCL  
Features  
High Luminous Flux  
Higher Forward Current Operation  
Capability  
N-GaP Substrate  
Au Alloy  
Optical Characteristics at T=25oC [See notes 1, 2, and 3]  
Typical Applications  
Dominant  
Flux  
Wavelength @5mA  
Intensity @20mA  
@20mA  
Signs/Signals  
Part  
Number  
D, nm)  
Typ.  
(lv, mcd)  
(mlm/A)  
Typ.  
Machine Vision  
Automotive Lighting  
Illumination  
Color  
Min.  
584  
584  
584  
612  
624  
624  
624  
Max.  
Min.  
Max.  
HWFR-B310 #101  
HWFR-B310 #102  
HWFR-B310 #112  
HWFR-B410 #102  
HWFR-B510 #101  
HWFR-B510 #102  
HWFR-B510 #112  
Amber  
Amber  
Amber  
Red/Orange  
Red  
-
-
595  
595  
70  
90  
90  
-
-
-
590.5 595  
70, 60%Min >90  
55  
-
625  
635  
635  
635  
100  
70  
100  
-
-
-
-
-
100  
-
Red  
-
Red  
629  
70, 60%Min >100  
70  
Electrical Characteristics at T=25oC [See notes 1 and 3]  
Reverse Voltage  
@ 100µA  
(Vbr, V)  
Min  
Forward Voltage @20mA  
Part  
Number  
(Vf, V)  
Typ.  
Color  
Min.  
Max.  
Notes:  
HWFR-B310  
HWFR-B410  
HWFR-B510  
Amber  
Red/Orange  
Red  
-6.0  
-6.0  
-6.0  
2.0  
2.0  
2.0  
2.35  
2.25  
2.25  
2.6  
2.6  
2.6  
1. lv and lambda values are based on a  
21 die sample. Vf, and Vr are 100%  
tested.  
2. Flux measurements were made using  
5mm LED lamp packages encapsulated  
with epoxy and are for information only.  
3. Typical values given are the average  
values expected and are for information  
only.  
Nominal Mechanical  
Specifications  
Visual Inspection and  
Testing [See note 1]  
Chip Size (mils)  
8.6 X 8.6  
Chip Height (mils)  
Junction Area (sq. mils)  
Top Metal  
10.5 +/- 1.5 mils  
74  
Visual Inspection  
Vf & Vr Testing  
Iv Testing  
100%  
100%  
Sample  
Sample  
4. Chips are mounted on 6 inch diameter  
photon rings utilizing 4 mil thick tape.  
Al/Au Zn  
Au/Ge  
Back Metal  
Chip Presentation [See Note 4]  
Lambda Testing  

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