是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | BGA, BGA256,16X16,40 | 针数: | 256 |
Reach Compliance Code: | compliant | ECCN代码: | 5A991 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.07 | Is Samacsys: | N |
运营商类型: | CEPT PCM-30/E-1 | 运营商类型(2): | T-1(DS1) |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 17 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 256 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA256,16X16,40 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
电源: | 1.8,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.76 mm | 子类别: | Other Telecom ICs |
最大压摆率: | 0.25 mA | 标称供电电压: | 1.8 V |
表面贴装: | YES | 电信集成电路类型: | FRAMER |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 17 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DS21458N | DALLAS |
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