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DS21Q552 PDF预览

DS21Q552

更新时间: 2024-10-27 22:10:15
品牌 Logo 应用领域
达拉斯 - DALLAS 数字传输接口电信集成电路电信电路PC
页数 文件大小 规格书
13页 167K
描述
Quad T1/E1 Transceiver 5V

DS21Q552 技术参数

生命周期:Transferred包装说明:MCM, BGA-256
Reach Compliance Code:unknown风险等级:5.74
Is Samacsys:NJESD-30 代码:S-PBGA-B256
功能数量:4端子数量:256
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
标称供电电压:5 V表面贴装:YES
技术:CMOS电信集成电路类型:PCM TRANSCEIVER
端子形式:BALL端子位置:BOTTOM
Base Number Matches:1

DS21Q552 数据手册

 浏览型号DS21Q552的Datasheet PDF文件第2页浏览型号DS21Q552的Datasheet PDF文件第3页浏览型号DS21Q552的Datasheet PDF文件第4页浏览型号DS21Q552的Datasheet PDF文件第5页浏览型号DS21Q552的Datasheet PDF文件第6页浏览型号DS21Q552的Datasheet PDF文件第7页 
DALLAS SEMICONDUCTOR  
Quad T1/E1 Transceiver (5V)  
Quad T1/E1 Transceiver (3.3V)  
Preliminary  
DS21Q552/DS21Q554  
DS21Q352/DS21Q354  
FEATURES  
P
·
Four (4) Completely Independent T1 or E1 Transceivers  
In One Small 27mm x 27mm Package  
·
Each Transceiver Contains a Short & Long Haul Line Interface  
Plus a Full Featured Framer with Alarm Detection/Generation,  
Elastic Stores, Hardware Based Signaling Support, Per DS0  
Channel Control and HDLC Controller  
·
·
Each Multi-Chip Module (MCM) Contains Four Die of:  
DS21352 (DS21Q352)  
DS21552 (DS21Q552)  
DS21354 (DS21Q354)  
DS21554 (DS21Q554)  
Selection Guide:  
Supply  
Device  
T1  
T1  
E1  
E1  
3.3V  
5V  
3.3V  
5V  
DS21Q352  
DS21Q552  
DS21Q354  
DS21Q554  
·
·
See the Specific DS21352/DS21552 and DS21354/DS21554  
Data Sheets for Details on their Feature Set and Operation  
All Four T1 or E1 Transceivers Can be Concatenated into a Single  
8.192MHz Backplane Data Stream  
·
·
IEEE 1149.1 JTAG-Boundary Scan Architecture  
DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible  
to Allow the Same Footprint to Support T1 and E1 Applications  
·
·
256–lead MCM BGA package (27mm X 27mm)  
Low Power 5V CMOS or Low Power 3.3V CMOS with 5V  
Tolerant Input & Outputs  
DESCRIPTION  
The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the  
DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.  
Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical  
connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and  
DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package  
size, some signals have been deleted. These differences are detailed in Table 1.  
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the  
DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the  
operating characteristics of the device.  
December 29, 1998  

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