是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | 14 X 14 MM, 1.40 MM HEIGHT, LQFP-100 |
针数: | 100 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.63 |
JESD-30 代码: | S-PQFP-G100 | JESD-609代码: | e0 |
长度: | 14 mm | 湿度敏感等级: | 3 |
功能数量: | 1 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFQFP |
封装形状: | SQUARE | 封装形式: | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 245 | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
电信集成电路类型: | FRAMER | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 14 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
DS21Q59L | DALLAS |
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