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DS2016-150+ PDF预览

DS2016-150+

更新时间: 2024-11-24 19:54:07
品牌 Logo 应用领域
美信 - MAXIM 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 167K
描述
Standard SRAM, 2KX8, 250ns, CMOS, PDIP24, 0.600 INCH, DIP-24

DS2016-150+ 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP,
针数:24Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.76最长访问时间:250 ns
其他特性:ALSO OPERATES WITH 4.5V TO 5.5V SUPPLYJESD-30 代码:R-PDIP-T24
JESD-609代码:e3长度:31.75 mm
内存密度:16384 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:24字数:2048 words
字数代码:2000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2KX8封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装形状:RECTANGULAR
封装形式:IN-LINE并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:5.08 mm最大供电电压 (Vsup):3.5 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

DS2016-150+ 数据手册

 浏览型号DS2016-150+的Datasheet PDF文件第2页浏览型号DS2016-150+的Datasheet PDF文件第3页浏览型号DS2016-150+的Datasheet PDF文件第4页浏览型号DS2016-150+的Datasheet PDF文件第5页浏览型号DS2016-150+的Datasheet PDF文件第6页浏览型号DS2016-150+的Datasheet PDF文件第7页 
DS2016  
2k x 8 3V/5V Operation  
Static RAM  
www.maxim-ic.com  
FEATURES  
PIN ASSIGNMENT  
C Low-power CMOS design  
C Standby current  
A7  
A6  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
V
CC  
A8  
2
50nA max at tA = 25°C VCC = 3.0V  
100nA max at tA = 25°C VCC = 5.5V  
1µA max at tA = 60°C VCC = 5.5V  
C Full operation for VCC = 5.5V to 2.7V  
C Data retention voltage = 5.5V to 2.0V  
C Fast 5V access time  
A5  
3
A9  
A4  
4
WE  
OE  
A3  
5
A2  
6
A10  
CE  
A1  
7
A0  
8
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ0  
DQ1  
DQ2  
GND  
9
DS2016-100  
DS2016-150  
100ns  
150ns  
10  
11  
12  
C Reduced-speed 3V access time  
DS2016-100  
DS2016-150  
250ns  
250ns  
DS2016 24-Pin DIP (600mil)  
DS2016R 24-Pin SO (300mil)  
C Operating temperature range of -40°C to  
+85°C  
PIN DESCRIPTION  
C Full static operation  
A0 to A10  
- Address Inputs  
C TTL compatible inputs and outputs over  
voltage range of 5.5V to 2.7V  
C Available in 24-pin DIP and 24-pin SO  
packages  
DQ0 to DQ7 - Data Input/Output  
CE  
WE  
OE  
- Chip Enable Input  
- Write Enable Input  
- Output Enable Input  
- Power Supply Input 2.7V - 5.5V  
- Ground  
C Suitable for both battery operated and battery  
backup applications  
VCC  
GND  
DESCRIPTION  
The DS2016 2k x 8 3V/5V Operation Static RAM is a 16,384-bit, low-power, fully static random access  
memory organized as 2048 words by 8 bits using CMOS technology. The device operates from a single  
power supply with a voltage input between 2.7V and 5.5V. The chip enable input (CE ) is used for device  
selection and can be used in order to achieve the minimum standby current mode, which facilitates both  
battery operated and battery backup applications. The device provides access times as fast as 100ns when  
operated from a 5V power supply input and also provides relatively good performance of 250ns access  
while operating from a 3V input. The device maintains TTL-level inputs and outputs over the input  
voltage range of 2.7V to 5.5V. The DS2016 is most suitable for low-power applications where battery  
operation or battery backup for nonvolatility is required. The DS2016 is a JEDEC-standard 2k x 8 SRAM  
and is pin-compatible with ROM and EPROM of similar density.  
1 of 9  
043002  

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