是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | 0.118 INCH, ROHS COMPLIANT, MICRO, SOP-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.63 | Is Samacsys: | N |
其他特性: | PUSHBUTTON RESET OPTION | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | S-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 3 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 8 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP8,.19 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.5/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.06 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.2 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX706ARESA+ | MAXIM |
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