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DS1645Y-120 PDF预览

DS1645Y-120

更新时间: 2024-11-19 20:52:43
品牌 Logo 应用领域
达拉斯 - DALLAS 静态存储器内存集成电路
页数 文件大小 规格书
12页 100K
描述
Non-Volatile SRAM Module, 128KX8, 120ns, CMOS,

DS1645Y-120 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.46
最长访问时间:120 ns其他特性:10 YEAR DATA RETENTION
JESD-30 代码:R-XDIP-P32JESD-609代码:e0
内存密度:1048576 bit内存集成电路类型:NON-VOLATILE SRAM MODULE
内存宽度:8功能数量:1
端子数量:32字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX8封装主体材料:UNSPECIFIED
封装代码:DIP封装等效代码:DIP32,.6
封装形状:RECTANGULAR封装形式:IN-LINE
并行/串行:PARALLEL电源:5 V
认证状态:Not Qualified最大待机电流:0.005 A
子类别:SRAMs最大压摆率:0.085 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:PIN/PEG
端子节距:2.54 mm端子位置:DUAL
Base Number Matches:1

DS1645Y-120 数据手册

 浏览型号DS1645Y-120的Datasheet PDF文件第2页浏览型号DS1645Y-120的Datasheet PDF文件第3页浏览型号DS1645Y-120的Datasheet PDF文件第4页浏览型号DS1645Y-120的Datasheet PDF文件第5页浏览型号DS1645Y-120的Datasheet PDF文件第6页浏览型号DS1645Y-120的Datasheet PDF文件第7页 
DS1645Y/AB  
DS1645Y/AB  
Partitionable 1024K NV SRAM  
FEATURES  
PIN ASSIGNMENT  
10 years minimum data retention in the absence of  
NC  
A16  
A14  
A12  
A7  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
V
CC  
external power  
2
A15  
NC  
Data is automatically protected during power loss  
Directly replaces 128K x 8 volatile static RAM  
3
4
WE  
A13  
A8  
5
Write protects selected blocks of memory when pro-  
grammed  
A6  
6
A5  
7
A9  
Unlimited write cycles  
A4  
8
A11  
OE  
A3  
9
Low-power CMOS  
A2  
10  
11  
12  
13  
14  
15  
16  
A10  
CE  
Read and write access times as fast as 70 ns  
A1  
A0  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
Lithium energy source is electrically disconnected to  
retainfreshness until power is applied for the firsttime  
DQ0  
DQ1  
DQ2  
GND  
Full +10% V operating range (DS1645Y)  
CC  
Optional +5% V operating range (DS1645AB)  
CC  
32-PIN ENCAPSULATED PACKAGE  
740 MIL EXTENDED  
o
Optional industrial temperature range of -40 C to  
o
+85 C, designated IND  
JEDEC standard 32-pin DIP package  
Low Profile Module (LPM) package  
NC  
A15  
A16  
PFO  
1
2
3
4
5
6
7
8
34  
NC  
NC  
A14  
A13  
A12  
A11  
A10  
A9  
A8  
A7  
A6  
A5  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
Fits into standard 68–pin PLCC surface mount-  
able socket  
V
CC  
WE  
OE  
CE  
250 mil package height  
DQ7  
DQ6  
DQ5  
DQ4  
DQ3  
DQ2  
DQ1  
DQ0  
GND  
9
Power Fail Output (PFO) warns system of  
10  
11  
12  
13  
14  
15  
16  
17  
impending V power failure  
CC  
A4  
A3  
A2  
A1  
A0  
34–PIN LOW PROFILE MODULE (LPM)  
ECopyright 1995 by Dallas Semiconductor Corporation.  
All Rights Reserved. For important information regarding  
patents and other intellectual property rights, please refer to  
Dallas Semiconductor data books.  
100495 1/12  

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